HANMI Semiconductor Co (XKRX:042700) Preferred Dividends : ₩0 Mil (TTM As of Mar. 2024)

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What is HANMI Semiconductor Co Preferred Dividends?

Preferred dividend is a dividend that is accrued and paid on a company's preferred shares. HANMI Semiconductor Co's preferred dividends for the three months ended in Mar. 2024 was ₩0 Mil. Its preferred dividends for the trailing twelve months (TTM) ended in Mar. 2024 was ₩0 Mil.

HANMI Semiconductor Co Preferred Dividends Historical Data

The historical data trend for HANMI Semiconductor Co's Preferred Dividends can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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HANMI Semiconductor Co Preferred Dividends Chart

HANMI Semiconductor Co Annual Data

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Preferred Dividends

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HANMI Semiconductor Co Quarterly Data
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HANMI Semiconductor Co Preferred Dividends Calculation

A dividend that is accrued and paid on a company's preferred shares.

HANMI Semiconductor Co (XKRX:042700) Preferred Dividends Explanation

In the event that a company is unable to pay all dividends, claims to preferred dividends take precedence over claims to dividends that are paid on common shares.

Preferred Dividends for the trailing twelve months (TTM) ended in Mar. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was ₩0 Mil.

HANMI Semiconductor Co (XKRX:042700) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » HANMI Semiconductor Co Ltd (XKRX:042700) » Definitions » Preferred Dividends

Traded in Other Exchanges

N/A

Address

532-2 Gajwa-Dong, Seo-gu, Incheon, KOR, 404-250

Website

http://www.hanmisemi.com

HANMI Semiconductor Co Ltd operates in semiconductor equipment business. The company has the largest worldwide market share for sewing and placement system. Its product portfolio divides into three main segments: Semiconductor Equipment, Laser Application Processes, PV and LED. Semiconductor division offer equipment such as singulation, flip chip binder, molding, trim and form, marking, inspection, pick and place, attach and detach, and PCB equipment. Laser Application Processes comprises laser marking, laser ablation, laser cutting and singulation as well as reel to reel laser. PV and LED offer equipment including PV brick IR inspection, PV wafer inspection, LED manual mold, among others.

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