HANMI Semiconductor Co (XKRX:042700) Interest Expense : ₩-72 Mil (TTM As of Mar. 2024)

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What is HANMI Semiconductor Co Interest Expense?

Interest Expense is the amount reported by a company or individual as an expense for borrowed money. HANMI Semiconductor Co's interest expense for the three months ended in Mar. 2024 was ₩ -15 Mil. Its interest expense for the trailing twelve months (TTM) ended in Mar. 2024 was ₩-72 Mil.

Interest Coverage is a ratio that determines how easily a company can pay interest expenses on outstanding debt. It is calculated by dividing a company's Operating Income(EBIT) by its Interest Expense. HANMI Semiconductor Co's Operating Income for the three months ended in Mar. 2024 was ₩ 28,706 Mil. HANMI Semiconductor Co's Interest Expense for the three months ended in Mar. 2024 was ₩ -15 Mil. HANMI Semiconductor Co's Interest Coverage for the quarter that ended in Mar. 2024 was 1,921.40. The higher the ratio, the stronger the company's financial strength is. Note: If both Interest Expense and Interest Income are empty, while Net Interest Income is negative, then use Net Interest Income as Interest Expense.

HANMI Semiconductor Co Interest Expense Historical Data

The historical data trend for HANMI Semiconductor Co's Interest Expense can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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HANMI Semiconductor Co Interest Expense Chart

HANMI Semiconductor Co Annual Data

Trend

Dec14

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Dec23

Interest Expense

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-105.61

-67.63

-36.64

-121.07

-79.07

HANMI Semiconductor Co Quarterly Data
	Jun19	Sep19	Dec19	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24
Interest Expense	Get a 7-Day Free Trial															-23.15	-20.69	-17.36	-18.61	-14.94

HANMI Semiconductor Co Interest Expense Calculation

Interest Expense is the amount reported by a company or individual as an expense for borrowed money.

Interest Expense for the trailing twelve months (TTM) ended in Mar. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was ₩-72 Mil.

HANMI Semiconductor Co (XKRX:042700) Interest Expense Explanation

Note: If both Interest Expense and Interest Income are empty, while Net Interest Income is negative, then use Net Interest Income as Interest Expense.

HANMI Semiconductor Co's Interest Expense for the three months ended in Mar. 2024 was ₩-15 Mil. Its Operating Income for the three months ended in Mar. 2024 was ₩28,706 Mil. And its Long-Term Debt & Capital Lease Obligation for the three months ended in Mar. 2024 was ₩369 Mil.

HANMI Semiconductor Co's Interest Coverage for the quarter that ended in Mar. 2024 is calculated as

Interest Coverage	=	-1	*	Operating Income (Q: Mar. 2024 )	/	Interest Expense (Q: Mar. 2024 )
	=	-1	*	28705.687	/	-14.94
	=	1,921.40

The higher the ratio, the stronger the company's financial strength is.

Good Sign:

Ben Graham prefers companies' interest coverage to be at least 5. HANMI Semiconductor Co Ltd has enough cash to cover all of its debt. Its financial situation is stable.

HANMI Semiconductor Co (XKRX:042700) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » HANMI Semiconductor Co Ltd (XKRX:042700) » Definitions » Interest Expense

Traded in Other Exchanges

N/A

Address

532-2 Gajwa-Dong, Seo-gu, Incheon, KOR, 404-250

Website

http://www.hanmisemi.com

HANMI Semiconductor Co Ltd operates in semiconductor equipment business. The company has the largest worldwide market share for sewing and placement system. Its product portfolio divides into three main segments: Semiconductor Equipment, Laser Application Processes, PV and LED. Semiconductor division offer equipment such as singulation, flip chip binder, molding, trim and form, marking, inspection, pick and place, attach and detach, and PCB equipment. Laser Application Processes comprises laser marking, laser ablation, laser cutting and singulation as well as reel to reel laser. PV and LED offer equipment including PV brick IR inspection, PV wafer inspection, LED manual mold, among others.

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