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HANMI Semiconductor Co (XKRX:042700) Insider Ownership : 0.00 % (As of Jun. 05, 2024)


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What is HANMI Semiconductor Co Insider Ownership?

Insider ownership is the percentage of shares that are owned by company insiders relative to the total shares outstanding. As of today, HANMI Semiconductor Co's insider ownership is 0.00%.

Institutional Ownership is the percentage of shares that are owned by institutions out of the total shares outstanding. As of today, HANMI Semiconductor Co's Institutional Ownership is 11.96%.

Float Percentage Of Total Shares Outstanding is the percentage of float shares relative to the total shares outstanding. As of today, HANMI Semiconductor Co's Float Percentage Of Total Shares Outstanding is 0.00%.


HANMI Semiconductor Co Insider Ownership Historical Data

The historical data trend for HANMI Semiconductor Co's Insider Ownership can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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HANMI Semiconductor Co Insider Ownership Chart

HANMI Semiconductor Co Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Insider Ownership
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HANMI Semiconductor Co Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
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HANMI Semiconductor Co Insider Ownership Calculation

The percentage of shares that are owned by company insiders relative to the total shares outstanding.


HANMI Semiconductor Co (XKRX:042700) Business Description

Traded in Other Exchanges
N/A
Address
532-2 Gajwa-Dong, Seo-gu, Incheon, KOR, 404-250
HANMI Semiconductor Co Ltd operates in semiconductor equipment business. The company has the largest worldwide market share for sewing and placement system. Its product portfolio divides into three main segments: Semiconductor Equipment, Laser Application Processes, PV and LED. Semiconductor division offer equipment such as singulation, flip chip binder, molding, trim and form, marking, inspection, pick and place, attach and detach, and PCB equipment. Laser Application Processes comprises laser marking, laser ablation, laser cutting and singulation as well as reel to reel laser. PV and LED offer equipment including PV brick IR inspection, PV wafer inspection, LED manual mold, among others.

HANMI Semiconductor Co (XKRX:042700) Headlines

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