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HANMI Semiconductor Co (XKRX:042700) Institutional Ownership : 13.06% (As of Jun. 05, 2024)


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What is HANMI Semiconductor Co Institutional Ownership?

Institutional ownership is the percentage of shares that are owned by institutions out of the total shares outstanding. As of today, HANMI Semiconductor Co's institutional ownership is 13.06%.

Insider Ownership is the percentage of shares that are owned by company insiders relative to the total shares outstanding. As of today, HANMI Semiconductor Co's Insider Ownership is 0.00%.

Float Percentage Of Total Shares Outstanding is the percentage of float shares relative to the total shares outstanding. As of today, HANMI Semiconductor Co's Float Percentage Of Total Shares Outstanding is 0.00%.


HANMI Semiconductor Co Institutional Ownership Historical Data

The historical data trend for HANMI Semiconductor Co's Institutional Ownership can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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HANMI Semiconductor Co Institutional Ownership Chart

HANMI Semiconductor Co Historical Data

The historical data trend for HANMI Semiconductor Co can be seen below:

2023-07-31 2023-08-31 2023-09-30 2023-10-31 2023-11-30 2023-12-31 2024-01-31 2024-02-29 2024-03-31 2024-04-30
Institutional Ownership 9.89 11.04 11.30 11.57 11.83 11.66 12.35 12.98 13.21 13.06

HANMI Semiconductor Co Institutional Ownership Calculation

The percentage of shares that are owned by institutions out of the total shares outstanding.


HANMI Semiconductor Co (XKRX:042700) Business Description

Traded in Other Exchanges
N/A
Address
532-2 Gajwa-Dong, Seo-gu, Incheon, KOR, 404-250
HANMI Semiconductor Co Ltd operates in semiconductor equipment business. The company has the largest worldwide market share for sewing and placement system. Its product portfolio divides into three main segments: Semiconductor Equipment, Laser Application Processes, PV and LED. Semiconductor division offer equipment such as singulation, flip chip binder, molding, trim and form, marking, inspection, pick and place, attach and detach, and PCB equipment. Laser Application Processes comprises laser marking, laser ablation, laser cutting and singulation as well as reel to reel laser. PV and LED offer equipment including PV brick IR inspection, PV wafer inspection, LED manual mold, among others.

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