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HANMI Semiconductor Co (XKRX:042700) Additional Paid-In Capital : ₩56,382 Mil(As of Mar. 2024)


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What is HANMI Semiconductor Co Additional Paid-In Capital?


HANMI Semiconductor Co's quarterly additional paid-in capital stayed the same from Sep. 2023 (₩56,382 Mil) to Dec. 2023 (₩56,382 Mil) and stayed the same from Dec. 2023 (₩56,382 Mil) to Mar. 2024 (₩56,382 Mil).

HANMI Semiconductor Co's annual additional paid-in capital stayed the same from Dec. 2021 (₩50,918 Mil) to Dec. 2022 (₩50,918 Mil) but then increased from Dec. 2022 (₩50,918 Mil) to Dec. 2023 (₩56,382 Mil).


HANMI Semiconductor Co Additional Paid-In Capital Historical Data

The historical data trend for HANMI Semiconductor Co's Additional Paid-In Capital can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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HANMI Semiconductor Co Additional Paid-In Capital Chart

HANMI Semiconductor Co Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Additional Paid-In Capital
Get a 7-Day Free Trial Premium Member Only Premium Member Only 47,889.96 47,889.96 50,917.90 50,917.90 56,382.07

HANMI Semiconductor Co Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Additional Paid-In Capital Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 50,917.90 56,382.07 56,382.07 56,382.07 56,382.07

HANMI Semiconductor Co Additional Paid-In Capital Calculation

Capital that a company raises in a financing round in excess of the capital's par value. The account represents the excess paid by an investor over the par-value price of a stock issue. Additional paid-in-capital can arise from issuing either preferred or common stock.

Additional Paid-In Capital is calculated as

Additional Paid-In Capital=(Issue Price-Par Value)* Shares Outstanding (Diluted Average)

HANMI Semiconductor Co Additional Paid-In Capital Related Terms

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HANMI Semiconductor Co (XKRX:042700) Business Description

Traded in Other Exchanges
N/A
Address
532-2 Gajwa-Dong, Seo-gu, Incheon, KOR, 404-250
HANMI Semiconductor Co Ltd operates in semiconductor equipment business. The company has the largest worldwide market share for sewing and placement system. Its product portfolio divides into three main segments: Semiconductor Equipment, Laser Application Processes, PV and LED. Semiconductor division offer equipment such as singulation, flip chip binder, molding, trim and form, marking, inspection, pick and place, attach and detach, and PCB equipment. Laser Application Processes comprises laser marking, laser ablation, laser cutting and singulation as well as reel to reel laser. PV and LED offer equipment including PV brick IR inspection, PV wafer inspection, LED manual mold, among others.

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