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China Wafer Level CSP Co (SHSE:603005) Tangible Book per Share : ¥5.74 (As of Mar. 2024)


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What is China Wafer Level CSP Co Tangible Book per Share?

Tangible book value per share is calculated as the total tangible equity divided by Shares Outstanding (EOP). Total tangible equity is calculated as the Total Stockholders Equity minus Preferred Stock minus Intangible Assets. China Wafer Level CSP Co's tangible book value per share for the quarter that ended in Mar. 2024 was ¥5.74.

Since intangibles such as goodwill cannot be sold when the company liquidates, tangible book value per share is considered more accurate in reflecting how much shareholders will receive when the company liquidates.


China Wafer Level CSP Co Tangible Book per Share Historical Data

The historical data trend for China Wafer Level CSP Co's Tangible Book per Share can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

China Wafer Level CSP Co Tangible Book per Share Chart

China Wafer Level CSP Co Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Tangible Book per Share
Get a 7-Day Free Trial Premium Member Only Premium Member Only 4.88 7.18 6.51 5.50 5.67

China Wafer Level CSP Co Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Tangible Book per Share Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 5.55 5.61 5.59 5.67 5.74

Competitive Comparison of China Wafer Level CSP Co's Tangible Book per Share

For the Semiconductors subindustry, China Wafer Level CSP Co's Price-to-Tangible-Book, along with its competitors' market caps and Price-to-Tangible-Book data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


China Wafer Level CSP Co's Price-to-Tangible-Book Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, China Wafer Level CSP Co's Price-to-Tangible-Book distribution charts can be found below:

* The bar in red indicates where China Wafer Level CSP Co's Price-to-Tangible-Book falls into.



China Wafer Level CSP Co Tangible Book per Share Calculation

China Wafer Level CSP Co's Tangible Book Value Per Share for the fiscal year that ended in Dec. 2023 is calculated as

Tangible Book Value per Share=(Total Stockholders Equity-Preferred Stock-Intangible Assets)/Shares Outstanding (EOP)
=(4088.743-0-387.194)/652.615
=5.67

China Wafer Level CSP Co's Tangible Book Value Per Share for the quarter that ended in Mar. 2024 is calculated as

Tangible Book Value per Share=(Total Stockholders Equity-Preferred Stock-Intangible Assets)/Shares Outstanding (EOP)
=(4133.695-0-386.716)/652.615
=5.74

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

Theoretically it is what the shareholders will receive if the company is liquidated. Total equity is a balance sheet item and equal to total assets less total liabilities of the company. Since intangibles such as goodwill cannot be sold when the company liquidates, tangible book value per share is considered more accurate in reflecting how much shareholders will receive when the company liquidates.


China Wafer Level CSP Co  (SHSE:603005) Tangible Book per Share Explanation

Usually a company's book value and Tangible Book per Share may not reflect its true value. The assets may be carried on the balance sheets at the original cost minus depreciation. This may underestimate the true economic values of the assets. It also may over-estimate their true economic value because the assets can become obsolete.

For financial companies such as banks and insurance companies, their assets may be reported in current market value of the assets owned. Book values of financial companies are more accurate indicator of the economic value of the company.


China Wafer Level CSP Co Tangible Book per Share Related Terms

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China Wafer Level CSP Co (SHSE:603005) Business Description

Traded in Other Exchanges
N/A
Address
No.29 Tinglan Lane, Suzhou Industrial Park, Jiangsu Province, Suzhou, CHN, 215026
China Wafer Level CSP Co Ltd is a Chinese company engaged in offering semiconductor packages. It supplies wafer-level chip size packaging and test services to the RFID markets. The company also provides co-design and qualification services for new products. The company's product portfolio includes image sensor, biometric identification, ambient light, medical electronic and automotive sensor devices.
Executives
Qian Xiao Qing senior management
Wang Wei Directors, senior managers
Duan Jia Guo senior management
senior management
Yang Xing Xin senior management
Wang Zhuo Wei senior management

China Wafer Level CSP Co (SHSE:603005) Headlines

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