China Wafer Level CSP Co (SHSE:603005) Change In Receivables : ¥0.0 Mil (TTM As of Mar. 2024)

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What is China Wafer Level CSP Co Change In Receivables?

China Wafer Level CSP Co's change in receivables for the quarter that ended in Mar. 2024 was ¥0.0 Mil. It means China Wafer Level CSP Co's Accounts Receivable stayed the same from Dec. 2023 to Mar. 2024 .

China Wafer Level CSP Co's change in receivables for the fiscal year that ended in Dec. 2023 was ¥37.6 Mil. It means China Wafer Level CSP Co's Accounts Receivable declined by ¥37.6 Mil from Dec. 2022 to Dec. 2023 .

China Wafer Level CSP Co's Accounts Receivable for the quarter that ended in Mar. 2024 was ¥101.0 Mil.

Days Sales Outstanding measures of the average number of days that a company takes to collect revenue after a sale has been made. It is a financial ratio that illustrates how well a company's Accounts Receivable are being managed. China Wafer Level CSP Co's Days Sales Outstanding for the three months ended in Mar. 2024 was 38.27.

In Ben Graham's calculation of liquidation value, Apple Inc's Accounts Receivable are only considered to be worth 75% of book value. China Wafer Level CSP Co's liquidation value for the three months ended in Mar. 2024 was ¥2,031.5 Mil.

China Wafer Level CSP Co Change In Receivables Historical Data

The historical data trend for China Wafer Level CSP Co's Change In Receivables can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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China Wafer Level CSP Co Change In Receivables Chart

China Wafer Level CSP Co Annual Data

Trend

Dec14

Dec15

Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Change In Receivables

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-56.99

-27.51

24.04

58.99

37.63

China Wafer Level CSP Co Quarterly Data
	Jun19	Sep19	Dec19	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24
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China Wafer Level CSP Co Change In Receivables Calculation

Change In Accounts Receivable relative to the previous period. It is any increase or decrease in the cash a company is owed by its customers.

Change In Receivables for the trailing twelve months (TTM) ended in Mar. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was ¥0.0 Mil.

China Wafer Level CSP Co (SHSE:603005) Change In Receivables Explanation

1. Accounts Receivable are created when a customer has received a product but has not yet paid for that product. Days Sales Outstanding measures of the average number of days that a company takes to collect revenue after a sale has been made. It is a financial ratio that illustrates how well a company's Accounts Receivable are being managed.

China Wafer Level CSP Co's Days Sales Outstanding for the quarter that ended in Mar. 2024 is calculated as:

	Days Sales Outstanding
=	Accounts Receivable	/	Revenue	*	Days in Period
=	101.002	/	240.846	*	91
=	38.27

2. In Ben Graham's calculation of liquidation value, China Wafer Level CSP Co's accounts receivable are only considered to be worth 75% of book value:

China Wafer Level CSP Co's liquidation value for the quarter that ended in Mar. 2024 is calculated as:

	Liquidation Value
=	Cash, Cash Equivalents, Marketable Securities	-	Total Liabilities	+	(0.75 * Accounts Receivable)	+	(0.5 * Total Inventories)
=	2649.82	-	758.711	+	0.75 * 101.002	+	0.5 * 129.237
=	2,031.5

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China Wafer Level CSP Co (SHSE:603005) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » China Wafer Level CSP Co Ltd (SHSE:603005) » Definitions » Change In Receivables

Comparable Companies

Traded in Other Exchanges

N/A

Address

No.29 Tinglan Lane, Suzhou Industrial Park, Jiangsu Province, Suzhou, CHN, 215026

Website

http://www.wlcsp.com

China Wafer Level CSP Co Ltd is a Chinese company engaged in offering semiconductor packages. It supplies wafer-level chip size packaging and test services to the RFID markets. The company also provides co-design and qualification services for new products. The company's product portfolio includes image sensor, biometric identification, ambient light, medical electronic and automotive sensor devices.

Executives

Qian Xiao Qing	senior management
Wang Wei	Directors, senior managers
Duan Jia Guo	senior management
	senior management
Yang Xing Xin	senior management
Wang Zhuo Wei	senior management

China Wafer Level CSP Co (SHSE:603005) Headlines

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