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China Wafer Level CSP Co (SHSE:603005) Debt-to-Asset : 0.09 (As of Mar. 2024)


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What is China Wafer Level CSP Co Debt-to-Asset?

China Wafer Level CSP Co's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was ¥232.8 Mil. China Wafer Level CSP Co's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was ¥193.1 Mil. China Wafer Level CSP Co's Long-Term Debt & Capital Lease ObligationTotal Assets for the quarter that ended in Mar. 2024 was ¥4,926.1 Mil. China Wafer Level CSP Co's debt to asset for the quarter that ended in Mar. 2024 was 0.09.


China Wafer Level CSP Co Debt-to-Asset Historical Data

The historical data trend for China Wafer Level CSP Co's Debt-to-Asset can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

China Wafer Level CSP Co Debt-to-Asset Chart

China Wafer Level CSP Co Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Debt-to-Asset
Get a 7-Day Free Trial Premium Member Only Premium Member Only - - 0.01 0.03 0.07

China Wafer Level CSP Co Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Debt-to-Asset Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.08 0.08 0.09 0.07 0.09

Competitive Comparison of China Wafer Level CSP Co's Debt-to-Asset

For the Semiconductors subindustry, China Wafer Level CSP Co's Debt-to-Asset, along with its competitors' market caps and Debt-to-Asset data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


China Wafer Level CSP Co's Debt-to-Asset Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, China Wafer Level CSP Co's Debt-to-Asset distribution charts can be found below:

* The bar in red indicates where China Wafer Level CSP Co's Debt-to-Asset falls into.



China Wafer Level CSP Co Debt-to-Asset Calculation

Debt to Asset measures the financial leverage a company has.

China Wafer Level CSP Co's Debt-to-Asset for the fiscal year that ended in Dec. 2023 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(211.959 + 134.834) / 4824.123
=0.07

China Wafer Level CSP Co's Debt-to-Asset for the quarter that ended in Mar. 2024 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(232.751 + 193.1) / 4926.082
=0.09

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


China Wafer Level CSP Co  (SHSE:603005) Debt-to-Asset Explanation

In the calculation of Debt-to-Asset, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by Total Assets.


China Wafer Level CSP Co Debt-to-Asset Related Terms

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China Wafer Level CSP Co (SHSE:603005) Business Description

Traded in Other Exchanges
N/A
Address
No.29 Tinglan Lane, Suzhou Industrial Park, Jiangsu Province, Suzhou, CHN, 215026
China Wafer Level CSP Co Ltd is a Chinese company engaged in offering semiconductor packages. It supplies wafer-level chip size packaging and test services to the RFID markets. The company also provides co-design and qualification services for new products. The company's product portfolio includes image sensor, biometric identification, ambient light, medical electronic and automotive sensor devices.

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