China Wafer Level CSP Co (SHSE:603005) Change In Payables And Accrued Expense : ¥0.0 Mil (TTM As of Mar. 2024)

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What is China Wafer Level CSP Co Change In Payables And Accrued Expense?

China Wafer Level CSP Co's Change In Payables And Accrued Expense for the quarter that ended in Mar. 2024 was ¥0.0 Mil. It means China Wafer Level CSP Co's Accounts Payable & Accrued Expense stayed the same from Dec. 2023 to Mar. 2024 .

China Wafer Level CSP Co's Change In Payables And Accrued Expense for the fiscal year that ended in Dec. 2023 was ¥0.0 Mil. It means China Wafer Level CSP Co's Accounts Payable & Accrued Expense stayed the same from Dec. 2022 to Dec. 2023 .

China Wafer Level CSP Co Change In Payables And Accrued Expense Historical Data

The historical data trend for China Wafer Level CSP Co's Change In Payables And Accrued Expense can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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China Wafer Level CSP Co Change In Payables And Accrued Expense Chart

China Wafer Level CSP Co Annual Data

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Change In Payables And Accrued Expense

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China Wafer Level CSP Co Quarterly Data
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China Wafer Level CSP Co Change In Payables And Accrued Expense Calculation

Change In Payables And Accrued Expense is the increase or decrease between periods of the Accounts Payable & Accrued Expense. Accrued expenses represent expenses incurred at the end of the reporting period but not yet paid; also called accrued liabilities. The accrued liability is shown under Liabilities section in the balance sheet.

Change In Payables And Accrued Expense for the trailing twelve months (TTM) ended in Mar. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was ¥0.0 Mil.

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China Wafer Level CSP Co (SHSE:603005) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » China Wafer Level CSP Co Ltd (SHSE:603005) » Definitions » Change In Payables And Accrued Expense

Comparable Companies

Traded in Other Exchanges

N/A

Address

No.29 Tinglan Lane, Suzhou Industrial Park, Jiangsu Province, Suzhou, CHN, 215026

Website

http://www.wlcsp.com

China Wafer Level CSP Co Ltd is a Chinese company engaged in offering semiconductor packages. It supplies wafer-level chip size packaging and test services to the RFID markets. The company also provides co-design and qualification services for new products. The company's product portfolio includes image sensor, biometric identification, ambient light, medical electronic and automotive sensor devices.

Executives

Qian Xiao Qing	senior management
Wang Wei	Directors, senior managers
Duan Jia Guo	senior management
	senior management
Yang Xing Xin	senior management
Wang Zhuo Wei	senior management

China Wafer Level CSP Co (SHSE:603005) Headlines

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