Hana Micron (XKRX:067310) Other Current Liabilities : ₩25,560 Mil (As of Mar. 2024)

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What is Hana Micron Other Current Liabilities?

Hana Micron's other current liabilities for the quarter that ended in Mar. 2024 was ₩25,560 Mil.

Hana Micron's quarterly other current liabilities declined from Sep. 2023 (₩18,123 Mil) to Dec. 2023 (₩17,406 Mil) but then increased from Dec. 2023 (₩17,406 Mil) to Mar. 2024 (₩25,560 Mil).

Hana Micron's annual other current liabilities increased from Dec. 2021 (₩20,116 Mil) to Dec. 2022 (₩28,680 Mil) but then declined from Dec. 2022 (₩28,680 Mil) to Dec. 2023 (₩17,406 Mil).

Hana Micron Other Current Liabilities Historical Data

The historical data trend for Hana Micron's Other Current Liabilities can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Hana Micron Other Current Liabilities Chart

Hana Micron Annual Data

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Other Current Liabilities

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Hana Micron Quarterly Data
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Hana Micron Other Current Liabilities Calculation

The liability a company needs to pay in the next 12 months, but not assigned to Accounts Payable or Debt. For instance, Wal-Mart (WMT) has accrued wages, salaries, valuation, bonuses, insurance liabilities, accrued tax etc. These are all included in other current liabilities.

Hana Micron Other Current Liabilities Related Terms

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Hana Micron (XKRX:067310) Business Description

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GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Hana Micron Inc (XKRX:067310) » Definitions » Other Current Liabilities

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Address

95-1,Wonnam-ri, Eumbong-myeon, Asan-si, Chungcheongnam-do, KOR, 336-864

Website

http://www.hanamicron.co.kr

Hana Micron Inc is a South Korea based company engages in the provision of semiconductor packaging solutions. Its products include flip chip ball grid array, wafer level chip scare packaging, system in package, fine pitch ball grid array, and lead frame base.

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