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Hana Micron (XKRX:067310) Debt-to-Revenue : 0.95 (As of Mar. 2024)


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What is Hana Micron Debt-to-Revenue?

Debt-to-Revenue measures a company's ability to pay off its debt.

Hana Micron's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was ₩476,838 Mil. Hana Micron's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was ₩542,207 Mil. Hana Micron's annualized Revenue for the quarter that ended in Mar. 2024 was ₩1,075,843 Mil. Hana Micron's annualized Debt-to-Revenue for the quarter that ended in Mar. 2024 was 0.95.


Hana Micron Debt-to-Revenue Historical Data

The historical data trend for Hana Micron's Debt-to-Revenue can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Hana Micron Debt-to-Revenue Chart

Hana Micron Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Debt-to-Revenue
Get a 7-Day Free Trial Premium Member Only Premium Member Only 0.73 0.79 0.62 0.76 1.01

Hana Micron Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Debt-to-Revenue Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.81 0.83 1.03 1.02 0.95

Competitive Comparison of Hana Micron's Debt-to-Revenue

For the Semiconductors subindustry, Hana Micron's Debt-to-Revenue, along with its competitors' market caps and Debt-to-Revenue data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Hana Micron's Debt-to-Revenue Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, Hana Micron's Debt-to-Revenue distribution charts can be found below:

* The bar in red indicates where Hana Micron's Debt-to-Revenue falls into.



Hana Micron Debt-to-Revenue Calculation

Debt-to-Revenue measures a company's ability to pay off its debt.

Hana Micron's Debt-to-Revenue for the fiscal year that ended in Dec. 2023 is calculated as

Debt-to-Revenue=Total Debt / Revenue
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Revenue
=(478250.509 + 503753.395) / 967971.485
=1.01

Hana Micron's annualized Debt-to-Revenue for the quarter that ended in Mar. 2024 is calculated as

Debt-to-Revenue=Total Debt / Revenue
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Revenue
=(476838.251 + 542206.548) / 1075842.836
=0.95

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

In the calculation of annual Debt-to-Revenue, the Revenue of the last fiscal year is used. In calculating the annualized quarterly data, the Revenue data used here is four times the quarterly (Mar. 2024) Revenue data.


Hana Micron Debt-to-Revenue Related Terms

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Hana Micron (XKRX:067310) Business Description

Traded in Other Exchanges
N/A
Address
95-1,Wonnam-ri, Eumbong-myeon, Asan-si, Chungcheongnam-do, KOR, 336-864
Hana Micron Inc is a South Korea based company engages in the provision of semiconductor packaging solutions. Its products include flip chip ball grid array, wafer level chip scare packaging, system in package, fine pitch ball grid array, and lead frame base.

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