Hana Micron (XKRX:067310) Issuance of Debt : ₩469,567 Mil (TTM As of Mar. 2024)

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What is Hana Micron Issuance of Debt?

Hana Micron's Issuance of Debt for the three months ended in Mar. 2024 was ₩85,853 Mil.

Hana Micron's Issuance of Debt for the trailing twelve months (TTM) ended in Mar. 2024 was ₩469,567 Mil.

Hana Micron Issuance of Debt Historical Data

The historical data trend for Hana Micron's Issuance of Debt can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Hana Micron Issuance of Debt Chart

Hana Micron Annual Data

Trend

Dec14

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Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Issuance of Debt

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335,964.52

202,337.11

160,842.76

540,580.34

486,713.94

Hana Micron Quarterly Data
	Jun19	Sep19	Dec19	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24
Issuance of Debt	Get a 7-Day Free Trial															103,000.00	79,627.03	220,023.92	84,063.00	85,853.23

Hana Micron Issuance of Debt Calculation

Issuance of Debt represents all the cash inflow from debt, including both long-term debt and short-term debt.

Issuance of Debt for the trailing twelve months (TTM) ended in Mar. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was ₩469,567 Mil.

Hana Micron Issuance of Debt Related Terms

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Hana Micron (XKRX:067310) Business Description

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GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Hana Micron Inc (XKRX:067310) » Definitions » Issuance of Debt

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Address

95-1,Wonnam-ri, Eumbong-myeon, Asan-si, Chungcheongnam-do, KOR, 336-864

Website

http://www.hanamicron.co.kr

Hana Micron Inc is a South Korea based company engages in the provision of semiconductor packaging solutions. Its products include flip chip ball grid array, wafer level chip scare packaging, system in package, fine pitch ball grid array, and lead frame base.

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