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Daeduck Electronics (XKRX:353200) Short-Term Debt : ₩6,836 Mil (As of Mar. 2024)


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What is Daeduck Electronics Short-Term Debt?

Daeduck Electronics's Short-Term Debt for the quarter that ended in Mar. 2024 was ₩6,836 Mil.

Daeduck Electronics's quarterly Short-Term Debt declined from Sep. 2023 (₩7,836 Mil) to Dec. 2023 (₩6,836 Mil) but then stayed the same from Dec. 2023 (₩6,836 Mil) to Mar. 2024 (₩6,836 Mil).

Daeduck Electronics's annual Short-Term Debt increased from Dec. 2021 (₩1,000 Mil) to Dec. 2022 (₩7,837 Mil) but then declined from Dec. 2022 (₩7,837 Mil) to Dec. 2023 (₩6,836 Mil).


Daeduck Electronics Short-Term Debt Historical Data

The historical data trend for Daeduck Electronics's Short-Term Debt can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Daeduck Electronics Short-Term Debt Chart

Daeduck Electronics Annual Data
Trend Dec20 Dec21 Dec22 Dec23
Short-Term Debt
9,080.57 1,000.00 7,836.89 6,836.17

Daeduck Electronics Quarterly Data
Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Short-Term Debt Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 7,836.17 7,836.17 7,836.17 6,836.17 6,836.17

Daeduck Electronics Short-Term Debt Explanation

Short-Term Debt represents the total amount of Long-Term Debt such as bank loans and commercial paper, which is due within one year.


Daeduck Electronics Short-Term Debt Related Terms

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Daeduck Electronics (XKRX:353200) Business Description

Traded in Other Exchanges
Address
230 Kangchon-ro, Danwon-gu, Gyeonggido, Ansan, KOR
Daeduck Electronics is a manufacturer of printed circuit boards (PCB) for semiconductor packaging. The company's products include ultra thin CSP, fcCSP, fcBGA, and System in Package. Its products are used in smartphones, networking, and automotive industry.

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