JCET Group Co (SHSE:600584) Short-Term Debt : ¥463 Mil (As of Mar. 2024)

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What is JCET Group Co Short-Term Debt?

JCET Group Co's Short-Term Debt for the quarter that ended in Mar. 2024 was ¥463 Mil.

JCET Group Co's quarterly Short-Term Debt declined from Sep. 2023 (¥1,721 Mil) to Dec. 2023 (¥1,696 Mil) and declined from Dec. 2023 (¥1,696 Mil) to Mar. 2024 (¥463 Mil).

JCET Group Co's annual Short-Term Debt declined from Dec. 2021 (¥2,193 Mil) to Dec. 2022 (¥1,174 Mil) but then increased from Dec. 2022 (¥1,174 Mil) to Dec. 2023 (¥1,696 Mil).

JCET Group Co Short-Term Debt Historical Data

The historical data trend for JCET Group Co's Short-Term Debt can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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JCET Group Co Short-Term Debt Chart

JCET Group Co Annual Data

Trend

Dec14

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Dec16

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Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Short-Term Debt

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9,098.06

5,288.40

2,193.14

1,173.66

1,695.89

JCET Group Co Quarterly Data
	Jun19	Sep19	Dec19	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24
Short-Term Debt	Get a 7-Day Free Trial															897.88	1,210.68	1,720.53	1,695.89	463.27

JCET Group Co Short-Term Debt Explanation

Short-Term Debt represents the total amount of Long-Term Debt such as bank loans and commercial paper, which is due within one year.

JCET Group Co Short-Term Debt Related Terms

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JCET Group Co (SHSE:600584) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » JCET Group Co Ltd (SHSE:600584) » Definitions » Short-Term Debt

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Traded in Other Exchanges

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Address

No. 99, Chengjiang East Road, Jiangsu Province, Jiangyin, CHN, 214431

Website

http://www.cj-elec.com

JCET Group Co Ltd is engaged in providing packaging design, product development, and certification, with a range of services including semiconductor design, wafer probe, bump, packaging, test and drop shipment. The company has a portfolio of technology and solutions, including the intellectual property (IP) rights of Fan-out embedded Wafer Level Ball Grid Array (eWLB), wafer level chip scale packaging (WLCSP), wafer bump, Package-on-Package (PoP), flip chip Ball Grid Array (fcBGA) and System-in-Package (SiP).

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