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JCET Group Co (SHSE:600584) Float Percentage Of Total Shares Outstanding : 0.00% (As of May. 27, 2024)


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What is JCET Group Co Float Percentage Of Total Shares Outstanding?

Float percentage of total shares outstanding is the percentage of float shares relative to the total shares outstanding. As of today, JCET Group Co's float shares is 0.00 Mil. JCET Group Co's total shares outstanding is 1,789.41 Mil. JCET Group Co's float percentage of total shares outstanding is 0.00%.

Insider Ownership is the percentage of shares that are owned by company insiders relative to the total shares outstanding. As of today, JCET Group Co's Insider Ownership is 0.00%.

Institutional Ownership is the percentage of shares that are owned by institutions out of the total shares outstanding. As of today, JCET Group Co's Institutional Ownership is 23.39%.

JCET Group Co Float Percentage Of Total Shares Outstanding Calculation

It is the percentage of float shares out of the total shares outstanding.

JCET Group Co's Float Percentage of Total Shares Outstanding for today is calculated as follows:

Float Percentage of Total Shares Outstanding=Float Shares/Total Shares Outstanding
=0.00/1,789.41
=0.00%

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

JCET Group Co (SHSE:600584) Business Description

Industry
GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » JCET Group Co Ltd (SHSE:600584) » Definitions » Float Percentage Of Total Shares Outstanding
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Traded in Other Exchanges
N/A
Address
No. 99, Chengjiang East Road, Jiangsu Province, Jiangyin, CHN, 214431
Website
http://www.cj-elec.com
JCET Group Co Ltd is engaged in providing packaging design, product development, and certification, with a range of services including semiconductor design, wafer probe, bump, packaging, test and drop shipment. The company has a portfolio of technology and solutions, including the intellectual property (IP) rights of Fan-out embedded Wafer Level Ball Grid Array (eWLB), wafer level chip scale packaging (WLCSP), wafer bump, Package-on-Package (PoP), flip chip Ball Grid Array (fcBGA) and System-in-Package (SiP).

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