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Micronics Japan Co (TSE:6871) Short-Term Capital Lease Obligation : 円0 Mil (As of Mar. 2024)


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What is Micronics Japan Co Short-Term Capital Lease Obligation?

Micronics Japan Co's Short-Term Capital Lease Obligation for the quarter that ended in Mar. 2024 was 円0 Mil.


Micronics Japan Co Short-Term Capital Lease Obligation Historical Data

The historical data trend for Micronics Japan Co's Short-Term Capital Lease Obligation can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Micronics Japan Co Short-Term Capital Lease Obligation Chart

Micronics Japan Co Annual Data
Trend Sep13 Sep14 Sep15 Sep16 Sep17 Sep18 Sep19 Sep20 Dec21 Dec22
Short-Term Capital Lease Obligation
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Micronics Japan Co Quarterly Data
Mar19 Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
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Micronics Japan Co Short-Term Capital Lease Obligation Explanation

Short-Term Capital Lease Obligation represents the total amount of Long-Term Capital Lease Obligation that must be paid within the next accounting period. Capital lease obligations are contractual obligations that arise from obtaining the use of property or equipment via a capital lease contract.


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Micronics Japan Co (TSE:6871) Business Description

Industry
Traded in Other Exchanges
Address
2-6-8 Kichijoji Hon-cho, Musashino-shi, Tokyo, JPN, 180 8508
Micronics Japan Co Ltd is a Japanese company which is engaged in manufacturing of semiconductor and related products. It mainly produces probe cards for testing the electrical properties of wafers, testing equipment and test sockets for property testing after packaging, and a wafer prober, which is used for evaluation and analysis of devices. The company also offers products such as array probers, which are used for testing the electrical properties of flat panel displays (FDP), automated optical inspection equipment used for the display inspection of panels, and probe units that send electrical signals to test panels. Its product portfolio includes probe cards, package probe, semiconductor test equipment, automated optical inspection equipment, probe units, and FDP prober products.

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