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Micronics Japan Co (TSE:6871) Debt-to-EBITDA : 0.12 (As of Dec. 2023)


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What is Micronics Japan Co Debt-to-EBITDA?

Debt-to-EBITDA measures a company's ability to pay off its debt.

Micronics Japan Co's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Dec. 2023 was 円966 Mil. Micronics Japan Co's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Dec. 2023 was 円372 Mil. Micronics Japan Co's annualized EBITDA for the quarter that ended in Dec. 2023 was 円10,892 Mil. Micronics Japan Co's annualized Debt-to-EBITDA for the quarter that ended in Dec. 2023 was 0.12.

A high Debt-to-EBITDA ratio generally means that a company may spend more time to paying off its debt. According to Joel Tillinghast's BIG MONEY THINKS SMALL: Biases, Blind Spots, and Smarter Investing, a ratio of Debt-to-EBITDA exceeding four is usually considered scary unless tangible assets cover the debt.

The historical rank and industry rank for Micronics Japan Co's Debt-to-EBITDA or its related term are showing as below:

TSE:6871' s Debt-to-EBITDA Range Over the Past 10 Years
Min: 0.1   Med: 0.42   Max: 2.1
Current: 0.24

During the past 13 years, the highest Debt-to-EBITDA Ratio of Micronics Japan Co was 2.10. The lowest was 0.10. And the median was 0.42.

TSE:6871's Debt-to-EBITDA is ranked better than
80.06% of 707 companies
in the Semiconductors industry
Industry Median: 1.61 vs TSE:6871: 0.24

Micronics Japan Co Debt-to-EBITDA Historical Data

The historical data trend for Micronics Japan Co's Debt-to-EBITDA can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Micronics Japan Co Debt-to-EBITDA Chart

Micronics Japan Co Annual Data
Trend Sep13 Sep14 Sep15 Sep16 Sep17 Sep18 Sep19 Sep20 Dec21 Dec22
Debt-to-EBITDA
Get a 7-Day Free Trial Premium Member Only Premium Member Only 0.27 0.43 0.36 0.10 0.10

Micronics Japan Co Quarterly Data
Dec18 Mar19 Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23
Debt-to-EBITDA Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.10 0.13 -0.96 0.26 0.12

Competitive Comparison of Micronics Japan Co's Debt-to-EBITDA

For the Semiconductor Equipment & Materials subindustry, Micronics Japan Co's Debt-to-EBITDA, along with its competitors' market caps and Debt-to-EBITDA data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Micronics Japan Co's Debt-to-EBITDA Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, Micronics Japan Co's Debt-to-EBITDA distribution charts can be found below:

* The bar in red indicates where Micronics Japan Co's Debt-to-EBITDA falls into.



Micronics Japan Co Debt-to-EBITDA Calculation

Debt-to-EBITDA measures a company's ability to pay off its debt.

Micronics Japan Co's Debt-to-EBITDA for the fiscal year that ended in Dec. 2022 is calculated as

Debt-to-EBITDA=Total Debt / EBITDA
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / EBITDA
=(834 + 439) / 12499
=0.10

Micronics Japan Co's annualized Debt-to-EBITDA for the quarter that ended in Dec. 2023 is calculated as

Debt-to-EBITDA=Total Debt / EBITDA
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / EBITDA
=(966 + 372) / 10892
=0.12

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

In the calculation of annual Debt-to-EBITDA, the EBITDA of the last fiscal year is used. In calculating the annualized quarterly data, the EBITDA data used here is four times the quarterly (Dec. 2023) EBITDA data.


Micronics Japan Co  (TSE:6871) Debt-to-EBITDA Explanation

In the calculation of Debt-to-EBITDA, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by EBITDA. In some calculations, Total Liabilities is used to for calculation.


Be Aware

A high Debt-to-EBITDA ratio generally means that a company may spend more time to paying off its debt.

According to Joel Tillinghast's BIG MONEY THINKS SMALL: Biases, Blind Spots, and Smarter Investing, a ratio of Debt-to-EBITDA exceeding four is usually considered scary unless tangible assets cover the debt.


Micronics Japan Co Debt-to-EBITDA Related Terms

Thank you for viewing the detailed overview of Micronics Japan Co's Debt-to-EBITDA provided by GuruFocus.com. Please click on the following links to see related term pages.


Micronics Japan Co (TSE:6871) Business Description

Traded in Other Exchanges
Address
2-6-8 Kichijoji Hon-cho, Musashino-shi, Tokyo, JPN, 180 8508
Micronics Japan Co Ltd is a Japanese company which is engaged in manufacturing of semiconductor and related products. It mainly produces probe cards for testing the electrical properties of wafers, testing equipment and test sockets for property testing after packaging, and a wafer prober, which is used for evaluation and analysis of devices. The company also offers products such as array probers, which are used for testing the electrical properties of flat panel displays (FDP), automated optical inspection equipment used for the display inspection of panels, and probe units that send electrical signals to test panels. Its product portfolio includes probe cards, package probe, semiconductor test equipment, automated optical inspection equipment, probe units, and FDP prober products.

Micronics Japan Co (TSE:6871) Headlines

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