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Winbond Electronics (TPE:2344) Research & Development : NT$16,799 Mil (TTM As of Mar. 2024)


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What is Winbond Electronics Research & Development?

Research & Development is the aggregate amount of research and development expenses during the year. Winbond Electronics's Research & Development for the three months ended in Mar. 2024 was NT$4,054 Mil. Its Research & Development for the trailing twelve months (TTM) ended in Mar. 2024 was NT$16,799 Mil.


Winbond Electronics Research & Development Historical Data

The historical data trend for Winbond Electronics's Research & Development can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Winbond Electronics Research & Development Chart

Winbond Electronics Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Research & Development
Get a 7-Day Free Trial Premium Member Only Premium Member Only 8,132.03 10,506.23 15,379.86 15,818.71 16,957.83

Winbond Electronics Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Research & Development Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 4,212.88 4,412.91 4,221.53 4,110.50 4,054.37

Winbond Electronics Research & Development Calculation

This is the expense the company spent on research and development.

Research & Development for the trailing twelve months (TTM) ended in Mar. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was NT$16,799 Mil.

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Winbond Electronics  (TPE:2344) Research & Development Explanation

If competitive advantage is created by a patent or tech advantage, at some point it will disappear.

High R&D usually dictates high SG&A which threatens the competitive advantage.


Winbond Electronics Research & Development Related Terms

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Winbond Electronics (TPE:2344) Business Description

Traded in Other Exchanges
N/A
Address
No. 8, Keya 1st Road, Central Science Park, Daya District, Taichung, TWN
Winbond Electronics Corp is engaged in the design, development, manufacture, and marketing of Very Large Scale Integration integrated circuits used in a variety of microelectronic applications. The company's operating segment includes DRAM IC products; Flash Memory product and Logic IC product. It generates maximum revenue from the Flash Memory product segment. The Flash Memory product segment engages mainly in the manufacturing, selling, researching, designing and after-sales service of Flash Memory product. Geographically, it derives a majority of revenue from Asia.

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