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Winbond Electronics (TPE:2344) Debt-to-Equity : 0.68 (As of Mar. 2024)


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What is Winbond Electronics Debt-to-Equity?

Winbond Electronics's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was NT$13,284 Mil. Winbond Electronics's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was NT$48,297 Mil. Winbond Electronics's Total Stockholders Equity for the quarter that ended in Mar. 2024 was NT$90,962 Mil. Winbond Electronics's debt to equity for the quarter that ended in Mar. 2024 was 0.68.

A high debt to equity ratio generally means that a company has been aggressive in financing its growth with debt. This can result in volatile earnings as a result of the additional interest expense.

The historical rank and industry rank for Winbond Electronics's Debt-to-Equity or its related term are showing as below:

TPE:2344' s Debt-to-Equity Range Over the Past 10 Years
Min: 0.17   Med: 0.39   Max: 0.68
Current: 0.68

During the past 13 years, the highest Debt-to-Equity Ratio of Winbond Electronics was 0.68. The lowest was 0.17. And the median was 0.39.

TPE:2344's Debt-to-Equity is ranked worse than
78.83% of 874 companies
in the Semiconductors industry
Industry Median: 0.26 vs TPE:2344: 0.68

Winbond Electronics Debt-to-Equity Historical Data

The historical data trend for Winbond Electronics's Debt-to-Equity can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Winbond Electronics Debt-to-Equity Chart

Winbond Electronics Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Debt-to-Equity
Get a 7-Day Free Trial Premium Member Only Premium Member Only 0.44 0.47 0.35 0.54 0.63

Winbond Electronics Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Debt-to-Equity Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.56 0.60 0.67 0.63 0.68

Competitive Comparison of Winbond Electronics's Debt-to-Equity

For the Semiconductors subindustry, Winbond Electronics's Debt-to-Equity, along with its competitors' market caps and Debt-to-Equity data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Winbond Electronics's Debt-to-Equity Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, Winbond Electronics's Debt-to-Equity distribution charts can be found below:

* The bar in red indicates where Winbond Electronics's Debt-to-Equity falls into.



Winbond Electronics Debt-to-Equity Calculation

Debt to Equity measures the financial leverage a company has.

Winbond Electronics's Debt to Equity Ratio for the fiscal year that ended in Dec. 2023 is calculated as

Winbond Electronics's Debt to Equity Ratio for the quarter that ended in Mar. 2024 is calculated as

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Winbond Electronics  (TPE:2344) Debt-to-Equity Explanation

In the calculation of Debt to Equity, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by Total Stockholders Equity. In some calculations, Total Liabilities is used to for calculation.


Be Aware

Because a company can increase its ROE % by having more financial leverage, it is important to watch the leverage ratio when investing in high ROE % companies.


Winbond Electronics Debt-to-Equity Related Terms

Thank you for viewing the detailed overview of Winbond Electronics's Debt-to-Equity provided by GuruFocus.com. Please click on the following links to see related term pages.


Winbond Electronics (TPE:2344) Business Description

Traded in Other Exchanges
N/A
Address
No. 8, Keya 1st Road, Central Science Park, Daya District, Taichung, TWN
Winbond Electronics Corp is engaged in the design, development, manufacture, and marketing of Very Large Scale Integration integrated circuits used in a variety of microelectronic applications. The company's operating segment includes DRAM IC products; Flash Memory product and Logic IC product. It generates maximum revenue from the Flash Memory product segment. The Flash Memory product segment engages mainly in the manufacturing, selling, researching, designing and after-sales service of Flash Memory product. Geographically, it derives a majority of revenue from Asia.

Winbond Electronics (TPE:2344) Headlines

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