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Nexchip Semiconductor (SHSE:688249) Other Current Liabilities : ¥782 Mil (As of Mar. 2024)


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What is Nexchip Semiconductor Other Current Liabilities?

Nexchip Semiconductor's other current liabilities for the quarter that ended in Mar. 2024 was ¥782 Mil.

Nexchip Semiconductor's quarterly other current liabilities increased from Sep. 2023 (¥725 Mil) to Dec. 2023 (¥902 Mil) but then declined from Dec. 2023 (¥902 Mil) to Mar. 2024 (¥782 Mil).

Nexchip Semiconductor's annual other current liabilities declined from Dec. 2021 (¥1,336 Mil) to Dec. 2022 (¥912 Mil) and declined from Dec. 2022 (¥912 Mil) to Dec. 2023 (¥902 Mil).


Nexchip Semiconductor Other Current Liabilities Historical Data

The historical data trend for Nexchip Semiconductor's Other Current Liabilities can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Nexchip Semiconductor Other Current Liabilities Chart

Nexchip Semiconductor Annual Data
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Nexchip Semiconductor Quarterly Data
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Nexchip Semiconductor Other Current Liabilities Calculation

The liability a company needs to pay in the next 12 months, but not assigned to Accounts Payable or Debt. For instance, Wal-Mart (WMT) has accrued wages, salaries, valuation, bonuses, insurance liabilities, accrued tax etc. These are all included in other current liabilities.


Nexchip Semiconductor Other Current Liabilities Related Terms

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Nexchip Semiconductor (SHSE:688249) Business Description

Traded in Other Exchanges
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Address
No. 88, West Feihe Road, Hefei Comprehensive Bonded Zone, Xinzhan District, Anhui Province, Hefei, CHN, 230011
Nexchip Semiconductor Corp is the first 12-inch wafer foundry enterprise in Anhui Province. The company focuses on semiconductor wafer production and foundry services and is committed to contributing to the improvement of domestic independent and controllable integrated circuit manufacturing capabilities, providing customers with different 150-55nm process technologies, and will introduce more advanced process technologies in the future. It is engaged in Research and development, production and sales of integrated circuit-related products and supporting products.

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