Nexchip Semiconductor (SHSE:688249) Change In Receivables : ¥0 Mil (TTM As of Mar. 2024)

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What is Nexchip Semiconductor Change In Receivables?

Nexchip Semiconductor's change in receivables for the quarter that ended in Mar. 2024 was ¥0 Mil. It means Nexchip Semiconductor's Accounts Receivable stayed the same from Dec. 2023 to Mar. 2024 .

Nexchip Semiconductor's change in receivables for the fiscal year that ended in Dec. 2023 was ¥1,773 Mil. It means Nexchip Semiconductor's Accounts Receivable declined by ¥1,773 Mil from Dec. 2022 to Dec. 2023 .

Nexchip Semiconductor's Accounts Receivable for the quarter that ended in Mar. 2024 was ¥795 Mil.

Days Sales Outstanding measures of the average number of days that a company takes to collect revenue after a sale has been made. It is a financial ratio that illustrates how well a company's Accounts Receivable are being managed. Nexchip Semiconductor's Days Sales Outstanding for the three months ended in Mar. 2024 was 32.56.

In Ben Graham's calculation of liquidation value, Apple Inc's Accounts Receivable are only considered to be worth 75% of book value. Nexchip Semiconductor's liquidation value for the three months ended in Mar. 2024 was ¥-16,641 Mil.

Nexchip Semiconductor Change In Receivables Historical Data

The historical data trend for Nexchip Semiconductor's Change In Receivables can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Nexchip Semiconductor Change In Receivables Chart

Nexchip Semiconductor Annual Data

Trend

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Change In Receivables

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-39.52

-185.91

-939.66

913.95

1,773.12

Nexchip Semiconductor Quarterly Data
	Dec18	Dec19	Dec20	Jun21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24
Change In Receivables	Get a 7-Day Free Trial									-	-	-	-	-

Nexchip Semiconductor Change In Receivables Calculation

Change In Accounts Receivable relative to the previous period. It is any increase or decrease in the cash a company is owed by its customers.

Change In Receivables for the trailing twelve months (TTM) ended in Mar. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was ¥0 Mil.

Nexchip Semiconductor (SHSE:688249) Change In Receivables Explanation

1. Accounts Receivable are created when a customer has received a product but has not yet paid for that product. Days Sales Outstanding measures of the average number of days that a company takes to collect revenue after a sale has been made. It is a financial ratio that illustrates how well a company's Accounts Receivable are being managed.

Nexchip Semiconductor's Days Sales Outstanding for the quarter that ended in Mar. 2024 is calculated as:

	Days Sales Outstanding
=	Accounts Receivable	/	Revenue	*	Days in Period
=	794.997	/	2227.893	*	91
=	32.56

2. In Ben Graham's calculation of liquidation value, Nexchip Semiconductor's accounts receivable are only considered to be worth 75% of book value:

Nexchip Semiconductor's liquidation value for the quarter that ended in Mar. 2024 is calculated as:

	Liquidation Value
=	Cash, Cash Equivalents, Marketable Securities	-	Total Liabilities	+	(0.75 * Accounts Receivable)	+	(0.5 * Total Inventories)
=	7963.068	-	25853.699	+	0.75 * 794.997	+	0.5 * 1306.292
=	-16,641

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Nexchip Semiconductor (SHSE:688249) Business Description

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GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Nexchip Semiconductor Corp (SHSE:688249) » Definitions » Change In Receivables

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Address

No. 88, West Feihe Road, Hefei Comprehensive Bonded Zone, Xinzhan District, Anhui Province, Hefei, CHN, 230011

Website

https://www.nexchip.com.cn

Nexchip Semiconductor Corp is the first 12-inch wafer foundry enterprise in Anhui Province. The company focuses on semiconductor wafer production and foundry services and is committed to contributing to the improvement of domestic independent and controllable integrated circuit manufacturing capabilities, providing customers with different 150-55nm process technologies, and will introduce more advanced process technologies in the future. It is engaged in Research and development, production and sales of integrated circuit-related products and supporting products.

Executives

Zhou Yi Liang	senior management
Cai Guo Zhi	Director
Cai Hui Jia	Senior management, core technical personnel
Zhu Cai Wei	Director

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