QPL International Holdings (HKSE:00243) Land And Improvements : HK$0.0 Mil (As of Oct. 2023)

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What is QPL International Holdings Land And Improvements?

QPL International Holdings's land and improvements for the quarter that ended in Oct. 2023 was HK$0.0 Mil.

QPL International Holdings Land And Improvements Historical Data

The historical data trend for QPL International Holdings's Land And Improvements can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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QPL International Holdings Land And Improvements Chart

QPL International Holdings Annual Data

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Land And Improvements

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QPL International Holdings Semi-Annual Data
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QPL International Holdings Land And Improvements Calculation

Land is the surface or crust of the earth, which can be used to support structures, and may be used to grow crops, grass, shrubs, and trees. Land is characterized as having an unlimited life (indefinite). Land improvement is a long-term asset which indicates the cost of the constructed improvements to land, such as driveways, walkways, lighting, and parking lots.

QPL International Holdings (HKSE:00243) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » QPL International Holdings Ltd (HKSE:00243) » Definitions » Land And Improvements

Comparable Companies

Traded in Other Exchanges

N/A

Address

22-28 Tai Chung Road, 8th Floor, Hale Weal Industrial Building, Tsuen Wan, New Territories, Hong Kong, HKG

Website

http://www.qpl.com

QPL International Holdings Ltd is engaged in the business of manufacturing and sale of integrated circuit lead frames, heatsinks, stiffners, and related products. The company derives the majority of its revenue from Malaysia, followed by the China. Some of the products of the company are small outline integrated circuit, quad flat package, thin quad flat package, plastic dual into package, plastic leaded chip carrier, and thin small outline package.

Executives

Hui Sau King Florence

2101 Beneficial owner

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