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QPL International Holdings (HKSE:00243) Debt-to-Asset : 0.10 (As of Oct. 2023)


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What is QPL International Holdings Debt-to-Asset?

QPL International Holdings's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Oct. 2023 was HK$50.6 Mil. QPL International Holdings's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Oct. 2023 was HK$0.0 Mil. QPL International Holdings's Long-Term Debt & Capital Lease ObligationTotal Assets for the quarter that ended in Oct. 2023 was HK$493.0 Mil. QPL International Holdings's debt to asset for the quarter that ended in Oct. 2023 was 0.10.


QPL International Holdings Debt-to-Asset Historical Data

The historical data trend for QPL International Holdings's Debt-to-Asset can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

QPL International Holdings Debt-to-Asset Chart

QPL International Holdings Annual Data
Trend Apr14 Apr15 Apr16 Apr17 Apr18 Apr19 Apr20 Apr21 Apr22 Apr23
Debt-to-Asset
Get a 7-Day Free Trial Premium Member Only Premium Member Only 0.02 0.12 0.20 0.18 0.11

QPL International Holdings Semi-Annual Data
Apr14 Oct14 Apr15 Oct15 Apr16 Oct16 Apr17 Oct17 Apr18 Oct18 Apr19 Oct19 Apr20 Oct20 Apr21 Oct21 Apr22 Oct22 Apr23 Oct23
Debt-to-Asset Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.19 0.18 0.14 0.11 0.10

Competitive Comparison of QPL International Holdings's Debt-to-Asset

For the Semiconductors subindustry, QPL International Holdings's Debt-to-Asset, along with its competitors' market caps and Debt-to-Asset data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


QPL International Holdings's Debt-to-Asset Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, QPL International Holdings's Debt-to-Asset distribution charts can be found below:

* The bar in red indicates where QPL International Holdings's Debt-to-Asset falls into.



QPL International Holdings Debt-to-Asset Calculation

Debt to Asset measures the financial leverage a company has.

QPL International Holdings's Debt-to-Asset for the fiscal year that ended in Apr. 2023 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(58.323 + 0.443) / 529.761
=0.11

QPL International Holdings's Debt-to-Asset for the quarter that ended in Oct. 2023 is calculated as

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


QPL International Holdings  (HKSE:00243) Debt-to-Asset Explanation

In the calculation of Debt-to-Asset, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by Total Assets.


QPL International Holdings Debt-to-Asset Related Terms

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QPL International Holdings (HKSE:00243) Business Description

Traded in Other Exchanges
N/A
Address
22-28 Tai Chung Road, 8th Floor, Hale Weal Industrial Building, Tsuen Wan, New Territories, Hong Kong, HKG
QPL International Holdings Ltd is engaged in the business of manufacturing and sale of integrated circuit lead frames, heatsinks, stiffners, and related products. The company derives the majority of its revenue from Malaysia, followed by the China. Some of the products of the company are small outline integrated circuit, quad flat package, thin quad flat package, plastic dual into package, plastic leaded chip carrier, and thin small outline package.
Executives
Hui Sau King Florence 2101 Beneficial owner

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