Chipbond Technology (ROCO:6147) Debt-to-Equity : 0.02 (As of Mar. 2024)

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What is Chipbond Technology Debt-to-Equity?

Chipbond Technology's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was NT$300 Mil. Chipbond Technology's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was NT$407 Mil. Chipbond Technology's Total Stockholders Equity for the quarter that ended in Mar. 2024 was NT$48,454 Mil. Chipbond Technology's debt to equity for the quarter that ended in Mar. 2024 was 0.01.

A high debt to equity ratio generally means that a company has been aggressive in financing its growth with debt. This can result in volatile earnings as a result of the additional interest expense.

The historical rank and industry rank for Chipbond Technology's Debt-to-Equity or its related term are showing as below:

ROCO:6147' s Debt-to-Equity Range Over the Past 10 Years
Min: 0.02 Med: 0.16 Max: 0.53
Current: 0.02

During the past 13 years, the highest Debt-to-Equity Ratio of Chipbond Technology was 0.53. The lowest was 0.02. And the median was 0.16.

ROCO:6147's Debt-to-Equity is ranked better than
90.96% of 874 companies
in the Semiconductors industry
Industry Median: 0.26 vs ROCO:6147: 0.02

Chipbond Technology Debt-to-Equity Historical Data

The historical data trend for Chipbond Technology's Debt-to-Equity can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Chipbond Technology Debt-to-Equity Chart

Chipbond Technology Annual Data

Trend

Dec14

Dec15

Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Debt-to-Equity

Get a 7-Day Free Trial

0.16

0.14

0.08

0.03

Chipbond Technology Quarterly Data
	Jun19	Sep19	Dec19	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24
Debt-to-Equity	Get a 7-Day Free Trial															0.09	0.09	0.08	0.03	0.02

Competitive Comparison of Chipbond Technology's Debt-to-Equity

For the Semiconductor Equipment & Materials subindustry, Chipbond Technology's Debt-to-Equity, along with its competitors' market caps and Debt-to-Equity data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.

Chipbond Technology's Debt-to-Equity Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, Chipbond Technology's Debt-to-Equity distribution charts can be found below:

* The bar in red indicates where Chipbond Technology's Debt-to-Equity falls into.

Chipbond Technology Debt-to-Equity Calculation

Debt to Equity measures the financial leverage a company has.

Chipbond Technology's Debt to Equity Ratio for the fiscal year that ended in Dec. 2023 is calculated as

Debt to Equity	=	Total Debt			/	Total Stockholders Equity
	=	(Short-Term Debt & Capital Lease Obligation	+	Long-Term Debt & Capital Lease Obligation)	/	Total Stockholders Equity
	=	(900	+	412.629)	/	48481.63
	=	0.03

Chipbond Technology's Debt to Equity Ratio for the quarter that ended in Mar. 2024 is calculated as

Debt to Equity	=	Total Debt			/	Total Stockholders Equity
	=	(Short-Term Debt & Capital Lease Obligation	+	Long-Term Debt & Capital Lease Obligation)	/	Total Stockholders Equity
	=	(300	+	406.539)	/	48454.11
	=	0.01

Chipbond Technology (ROCO:6147) Debt-to-Equity Explanation

In the calculation of Debt to Equity, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by Total Stockholders Equity. In some calculations, Total Liabilities is used to for calculation.

Be Aware

Because a company can increase its ROE % by having more financial leverage, it is important to watch the leverage ratio when investing in high ROE % companies.

Chipbond Technology Debt-to-Equity Related Terms

Thank you for viewing the detailed overview of Chipbond Technology's Debt-to-Equity provided by GuruFocus.com. Please click on the following links to see related term pages.

Chipbond Technology (ROCO:6147) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Chipbond Technology Corp (ROCO:6147) » Definitions » Debt-to-Equity

Comparable Companies

Traded in Other Exchanges

N/A

Address

No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300

Website

http://www.chipbond.com.tw

Chipbond Technology Corp along is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services.

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