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Chipbond Technology (ROCO:6147) Cash-to-Debt : 10.91 (As of Mar. 2024)


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What is Chipbond Technology Cash-to-Debt?

Cash to Debt Ratio measures the financial strength of a company. It is calculated as a company's cash, cash equivalents, and marketable securities divide by its debt. Chipbond Technology's cash to debt ratio for the quarter that ended in Mar. 2024 was 10.91.

If Cash to Debt ratio is greater than 1, the company can pay off its debt using the cash in hand. Here we can see, Chipbond Technology could pay off its debt using the cash in hand for the quarter that ended in Mar. 2024.

The historical rank and industry rank for Chipbond Technology's Cash-to-Debt or its related term are showing as below:

ROCO:6147' s Cash-to-Debt Range Over the Past 10 Years
Min: 0.44   Med: 1.23   Max: 10.91
Current: 10.91

During the past 13 years, Chipbond Technology's highest Cash to Debt Ratio was 10.91. The lowest was 0.44. And the median was 1.23.

ROCO:6147's Cash-to-Debt is ranked better than
74.8% of 992 companies
in the Semiconductors industry
Industry Median: 1.79 vs ROCO:6147: 10.91

Chipbond Technology Cash-to-Debt Historical Data

The historical data trend for Chipbond Technology's Cash-to-Debt can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

Note: An indication of "No Debt" does not necessarily mean that the company has no debt obligations; it could be due to missing data in the quarterly or annual report. Use caution when interpreting this information.

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Chipbond Technology Cash-to-Debt Chart

Chipbond Technology Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Cash-to-Debt
Get a 7-Day Free Trial Premium Member Only Premium Member Only 1.53 0.92 0.95 1.70 4.29

Chipbond Technology Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Cash-to-Debt Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 1.97 1.81 1.32 4.29 10.91

Competitive Comparison of Chipbond Technology's Cash-to-Debt

For the Semiconductor Equipment & Materials subindustry, Chipbond Technology's Cash-to-Debt, along with its competitors' market caps and Cash-to-Debt data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Chipbond Technology's Cash-to-Debt Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, Chipbond Technology's Cash-to-Debt distribution charts can be found below:

* The bar in red indicates where Chipbond Technology's Cash-to-Debt falls into.



Chipbond Technology Cash-to-Debt Calculation

This is the ratio of a company's Cash, Cash Equivalents, Marketable Securities to its debt. The debt includes the Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation. This ratio measures the financial strength of a company. This ratio is updated quarterly.

Chipbond Technology's Cash to Debt Ratio for the fiscal year that ended in Dec. 2023 is calculated as:

Chipbond Technology's Cash to Debt Ratio for the quarter that ended in Mar. 2024 is calculated as:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Chipbond Technology  (ROCO:6147) Cash-to-Debt Explanation

If Cash to Debt ratio is greater than 1, the company can pay off its debt using the cash in hand. If it is smaller than 1, it means the company has more debt than the cash in hands. In this case, it is important to look the the company's Interest Coverage. Ben Graham requires that a company must have an Interest Coverage of at least 5.


Chipbond Technology Cash-to-Debt Related Terms

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Chipbond Technology (ROCO:6147) Business Description

Traded in Other Exchanges
N/A
Address
No 3, Li Hsin 5th Road, Hsinchu Science Park, Hsinchu, TWN, 300
Chipbond Technology Corp along is engaged in the research, development, manufacturing, and sale of driver IC and non-driver IC packaging and testing services.

Chipbond Technology (ROCO:6147) Headlines

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