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TongFu Microelectronics Co (SZSE:002156) Debt-to-Asset : 0.41 (As of Mar. 2024)


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What is TongFu Microelectronics Co Debt-to-Asset?

TongFu Microelectronics Co's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was ¥7,409 Mil. TongFu Microelectronics Co's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was ¥6,890 Mil. TongFu Microelectronics Co's Long-Term Debt & Capital Lease ObligationTotal Assets for the quarter that ended in Mar. 2024 was ¥35,021 Mil. TongFu Microelectronics Co's debt to asset for the quarter that ended in Mar. 2024 was 0.41.


TongFu Microelectronics Co Debt-to-Asset Historical Data

The historical data trend for TongFu Microelectronics Co's Debt-to-Asset can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

TongFu Microelectronics Co Debt-to-Asset Chart

TongFu Microelectronics Co Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Debt-to-Asset
Get a 7-Day Free Trial Premium Member Only Premium Member Only 0.36 0.32 0.34 0.34 0.40

TongFu Microelectronics Co Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Debt-to-Asset Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.36 0.39 0.40 0.40 0.41

Competitive Comparison of TongFu Microelectronics Co's Debt-to-Asset

For the Semiconductor Equipment & Materials subindustry, TongFu Microelectronics Co's Debt-to-Asset, along with its competitors' market caps and Debt-to-Asset data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


TongFu Microelectronics Co's Debt-to-Asset Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, TongFu Microelectronics Co's Debt-to-Asset distribution charts can be found below:

* The bar in red indicates where TongFu Microelectronics Co's Debt-to-Asset falls into.



TongFu Microelectronics Co Debt-to-Asset Calculation

Debt to Asset measures the financial leverage a company has.

TongFu Microelectronics Co's Debt-to-Asset for the fiscal year that ended in Dec. 2023 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(8005.641 + 6002.589) / 34877.71
=0.40

TongFu Microelectronics Co's Debt-to-Asset for the quarter that ended in Mar. 2024 is calculated as

Debt-to-Asset=Total Debt / Total Assets
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / Total Assets
=(7409.371 + 6889.554) / 35020.876
=0.41

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


TongFu Microelectronics Co  (SZSE:002156) Debt-to-Asset Explanation

In the calculation of Debt-to-Asset, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by Total Assets.


TongFu Microelectronics Co Debt-to-Asset Related Terms

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TongFu Microelectronics Co (SZSE:002156) Business Description

Traded in Other Exchanges
N/A
Address
No. 288 Chongchuan Road, Chongchuan Development Zone, Jiangsu province, Nantong, CHN, 226006
TongFu Microelectronics Co Ltd operates in the semiconductor industry. The company is specializing in integrated circuit assembling and testing. The company provides customers with a full range of test platforms and engineering services to support a wide range of analog and mixed-signal, automotive, radio frequency, digital semiconductor devices, baseband, and application specific integrated circuits. Its other products and services include wafer bump services, probe, final test and post-test services.
Executives
Zhang Xiao Ping Executives
Shi Lei Directors, executives
Gao Feng Directors, executives
Xia Xin Directors, executives
Jiang Shu Directors, executives
Zhu Hong Chao Executives
Shi Ming Da Director
Qian Jian Zhong Executives
Dai Yu Feng Supervisors

TongFu Microelectronics Co (SZSE:002156) Headlines

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