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Micronics Japan Co (STU:MJ3) Total Current Liabilities : €87.6 Mil (As of Mar. 2024)


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What is Micronics Japan Co Total Current Liabilities?

Total current liabilities includes Accounts Payable & Accrued Expense, Short-Term Debt & Capital Lease Obligation, Other Current Liabilities, and Current Deferred Liabilities. Micronics Japan Co's total current liabilities for the quarter that ended in Mar. 2024 was €87.6


Micronics Japan Co Total Current Liabilities Historical Data

The historical data trend for Micronics Japan Co's Total Current Liabilities can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Micronics Japan Co Total Current Liabilities Chart

Micronics Japan Co Annual Data
Trend Sep13 Sep14 Sep15 Sep16 Sep17 Sep18 Sep19 Sep20 Dec21 Dec22
Total Current Liabilities
Get a 7-Day Free Trial Premium Member Only Premium Member Only 68.65 72.13 81.68 110.55 91.93

Micronics Japan Co Quarterly Data
Mar19 Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Total Current Liabilities Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 78.44 67.09 68.73 76.97 87.65

Micronics Japan Co Total Current Liabilities Calculation

Total Current Liabilities is the total amount of liabilities that the company needs to pay over the next 12 months.

Micronics Japan Co's Total Current Liabilities for the fiscal year that ended in Dec. 2022 is calculated as

Total Current Liabilities=Accounts Payable & Accrued Expense+Short-Term Debt & Capital Lease Obligation
=59.726+5.836
+Other Current Liabilities+Current Deferred Liabilities
=26.372+0
=91.9

Micronics Japan Co's Total Current Liabilities for the quarter that ended in Mar. 2024 is calculated as

Total Current Liabilities=Accounts Payable & Accrued Expense+Short-Term Debt & Capital Lease Obligation
=46.234+4.151
+Other Current Liabilities+Current Deferred Liabilities
=37.262+0
=87.6

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

The increase of Total Current Liabilities of a company is not necessarily a bad thing. This may conserve the company's cash and contribute positively to cash flow.

Total Current Liabilities is linked to Total Current Assets through the Current Ratio and Working Capital. The Current Ratio is equal to dividing total current assets by total current liabilities. It is frequently used as an indicator of a company's liquidity, its ability to meet short-term obligations. Net working capital is calculated as Total Current Assets minus Total Current Liabilities.


Be Aware

Stay away from companies that roll over the debt e.g. Bear Stearns

When investing in financial institutions, Buffett shies from those who are bigger borrowers of short term than long term debt.

His favorite Wells Fargo has 57 cents short term debt for every dollar of long term.

Aggressive banks (like Bank of America) has $2.09 short term for every dollar long term


Micronics Japan Co Total Current Liabilities Related Terms

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Micronics Japan Co (STU:MJ3) Business Description

Traded in Other Exchanges
Address
2-6-8 Kichijoji Hon-cho, Musashino-shi, Tokyo, JPN, 180 8508
Micronics Japan Co Ltd is a Japanese company which is engaged in manufacturing of semiconductor and related products. It mainly produces probe cards for testing the electrical properties of wafers, testing equipment and test sockets for property testing after packaging, and a wafer prober, which is used for evaluation and analysis of devices. The company also offers products such as array probers, which are used for testing the electrical properties of flat panel displays (FDP), automated optical inspection equipment used for the display inspection of panels, and probe units that send electrical signals to test panels. Its product portfolio includes probe cards, package probe, semiconductor test equipment, automated optical inspection equipment, probe units, and FDP prober products.

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