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Microelectronics Technology (TPE:2314) Debt-to-EBITDA : -6.46 (As of Mar. 2024)


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What is Microelectronics Technology Debt-to-EBITDA?

Debt-to-EBITDA measures a company's ability to pay off its debt.

Microelectronics Technology's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was NT$2,148 Mil. Microelectronics Technology's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was NT$478 Mil. Microelectronics Technology's annualized EBITDA for the quarter that ended in Mar. 2024 was NT$-406 Mil. Microelectronics Technology's annualized Debt-to-EBITDA for the quarter that ended in Mar. 2024 was -6.46.

A high Debt-to-EBITDA ratio generally means that a company may spend more time to paying off its debt. According to Joel Tillinghast's BIG MONEY THINKS SMALL: Biases, Blind Spots, and Smarter Investing, a ratio of Debt-to-EBITDA exceeding four is usually considered scary unless tangible assets cover the debt.

The historical rank and industry rank for Microelectronics Technology's Debt-to-EBITDA or its related term are showing as below:

TPE:2314' s Debt-to-EBITDA Range Over the Past 10 Years
Min: -14.43   Med: 1.95   Max: 13.12
Current: -7.24

During the past 13 years, the highest Debt-to-EBITDA Ratio of Microelectronics Technology was 13.12. The lowest was -14.43. And the median was 1.95.

TPE:2314's Debt-to-EBITDA is ranked worse than
100% of 1740 companies
in the Hardware industry
Industry Median: 1.8 vs TPE:2314: -7.24

Microelectronics Technology Debt-to-EBITDA Historical Data

The historical data trend for Microelectronics Technology's Debt-to-EBITDA can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

* Premium members only.

Microelectronics Technology Debt-to-EBITDA Chart

Microelectronics Technology Annual Data
Trend Dec14 Dec15 Dec16 Dec17 Dec18 Dec19 Dec20 Dec21 Dec22 Dec23
Debt-to-EBITDA
Get a 7-Day Free Trial Premium Member Only Premium Member Only 4.13 13.12 -11.26 -14.43 -11.16

Microelectronics Technology Quarterly Data
Jun19 Sep19 Dec19 Mar20 Jun20 Sep20 Dec20 Mar21 Jun21 Sep21 Dec21 Mar22 Jun22 Sep22 Dec22 Mar23 Jun23 Sep23 Dec23 Mar24
Debt-to-EBITDA Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 35.58 -22.28 -6.71 -5.57 -6.46

Competitive Comparison of Microelectronics Technology's Debt-to-EBITDA

For the Communication Equipment subindustry, Microelectronics Technology's Debt-to-EBITDA, along with its competitors' market caps and Debt-to-EBITDA data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Microelectronics Technology's Debt-to-EBITDA Distribution in the Hardware Industry

For the Hardware industry and Technology sector, Microelectronics Technology's Debt-to-EBITDA distribution charts can be found below:

* The bar in red indicates where Microelectronics Technology's Debt-to-EBITDA falls into.



Microelectronics Technology Debt-to-EBITDA Calculation

Debt-to-EBITDA measures a company's ability to pay off its debt.

Microelectronics Technology's Debt-to-EBITDA for the fiscal year that ended in Dec. 2023 is calculated as

Debt-to-EBITDA=Total Debt / EBITDA
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / EBITDA
=(2111.739 + 577.278) / -240.925
=-11.16

Microelectronics Technology's annualized Debt-to-EBITDA for the quarter that ended in Mar. 2024 is calculated as

Debt-to-EBITDA=Total Debt / EBITDA
=(Short-Term Debt & Capital Lease Obligation + Long-Term Debt & Capital Lease Obligation) / EBITDA
=(2148.411 + 478.092) / -406.4
=-6.46

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

In the calculation of annual Debt-to-EBITDA, the EBITDA of the last fiscal year is used. In calculating the annualized quarterly data, the EBITDA data used here is four times the quarterly (Mar. 2024) EBITDA data.


Microelectronics Technology  (TPE:2314) Debt-to-EBITDA Explanation

In the calculation of Debt-to-EBITDA, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by EBITDA. In some calculations, Total Liabilities is used to for calculation.


Be Aware

A high Debt-to-EBITDA ratio generally means that a company may spend more time to paying off its debt.

According to Joel Tillinghast's BIG MONEY THINKS SMALL: Biases, Blind Spots, and Smarter Investing, a ratio of Debt-to-EBITDA exceeding four is usually considered scary unless tangible assets cover the debt.


Microelectronics Technology Debt-to-EBITDA Related Terms

Thank you for viewing the detailed overview of Microelectronics Technology's Debt-to-EBITDA provided by GuruFocus.com. Please click on the following links to see related term pages.


Microelectronics Technology (TPE:2314) Business Description

Traded in Other Exchanges
N/A
Address
No 1, Innovation Road II, Hsinchu Science Park, Hsinchu, TWN, 300
Microelectronics Technology Inc is engaged in the design, manufacture and sales of terrestrial microwave, satellite and photoelectric communication system products, and related customized products. The company's products include Low Noise Block Downconverter, Very Small Aperture Terminal, mobile products, microwave radio, and RFID. It operates in United States, Mainland China, and others.

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