Biwin Storage Technology Co (SHSE:688525) Debt-to-Asset : 0.55 (As of Mar. 2024)

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What is Biwin Storage Technology Co Debt-to-Asset?

Biwin Storage Technology Co's Short-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was ¥2,969 Mil. Biwin Storage Technology Co's Long-Term Debt & Capital Lease Obligation for the quarter that ended in Mar. 2024 was ¥570 Mil. Biwin Storage Technology Co's Long-Term Debt & Capital Lease ObligationTotal Assets for the quarter that ended in Mar. 2024 was ¥6,465 Mil. Biwin Storage Technology Co's debt to asset for the quarter that ended in Mar. 2024 was 0.55.

Biwin Storage Technology Co Debt-to-Asset Historical Data

The historical data trend for Biwin Storage Technology Co's Debt-to-Asset can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Biwin Storage Technology Co Debt-to-Asset Chart

Biwin Storage Technology Co Annual Data

Trend

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

Debt-to-Asset

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0.15

0.16

0.36

0.57

Biwin Storage Technology Co Quarterly Data
	Dec18	Dec19	Dec20	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24
Debt-to-Asset	Get a 7-Day Free Trial										0.46	0.53	0.57	0.57	0.55

Competitive Comparison of Biwin Storage Technology Co's Debt-to-Asset

For the Semiconductors subindustry, Biwin Storage Technology Co's Debt-to-Asset, along with its competitors' market caps and Debt-to-Asset data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.

Biwin Storage Technology Co's Debt-to-Asset Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, Biwin Storage Technology Co's Debt-to-Asset distribution charts can be found below:

* The bar in red indicates where Biwin Storage Technology Co's Debt-to-Asset falls into.

Biwin Storage Technology Co Debt-to-Asset Calculation

Debt to Asset measures the financial leverage a company has.

Biwin Storage Technology Co's Debt-to-Asset for the fiscal year that ended in Dec. 2023 is calculated as

Debt-to-Asset	=	Total Debt			/	Total Assets
	=	(Short-Term Debt & Capital Lease Obligation	+	Long-Term Debt & Capital Lease Obligation)	/	Total Assets
	=	(3069.121	+	510.572)	/	6332.401
	=	0.57

Biwin Storage Technology Co's Debt-to-Asset for the quarter that ended in Mar. 2024 is calculated as

Debt-to-Asset	=	Total Debt			/	Total Assets
	=	(Short-Term Debt & Capital Lease Obligation	+	Long-Term Debt & Capital Lease Obligation)	/	Total Assets
	=	(2969.213	+	570.309)	/	6464.751
	=	0.55

Biwin Storage Technology Co (SHSE:688525) Debt-to-Asset Explanation

In the calculation of Debt-to-Asset, we use the total of Short-Term Debt & Capital Lease Obligation and Long-Term Debt & Capital Lease Obligation divided by Total Assets.

Biwin Storage Technology Co Debt-to-Asset Related Terms

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Biwin Storage Technology Co (SHSE:688525) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Biwin Storage Technology Co Ltd (SHSE:688525) » Definitions » Debt-to-Asset

Comparable Companies

Traded in Other Exchanges

N/A

Address

No. 1213, Liuxian Avenue, Taoyuan Street, Floor 1-3, Building 4, Building 4, Zone 2, Zhongguan Honghualing Industrial South District, Pingshan Community, Nanshan District, Guangdong, Shenzhen, CHN, 518055

Website

https://www.biwin.com.cn

Biwin Storage Technology Co Ltd focuses on the research and development and packaging and testing of memory chips. The company integrates storage medium characteristic research, firmware algorithm development, storage chip advanced packaging, storage chip test equipment R&D and algorithm development, brand operation and others. Its memory chip products are widely used in mobile smart terminals, PCs, industry terminals, data centers, smart cars, mobile storage and other information technology fields.

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