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Great Microwave Technology Co (SHSE:688270) Payments of Debt : ¥0.0 Mil (TTM As of Mar. 2024)


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What is Great Microwave Technology Co Payments of Debt?

Great Microwave Technology Co's Payments of Debt for the three months ended in Mar. 2024 was ¥0.0 Mil.

Great Microwave Technology Co's Payments of Debt for the trailing twelve months (TTM) ended in Mar. 2024 was ¥0.0 Mil.


Great Microwave Technology Co Payments of Debt Historical Data

The historical data trend for Great Microwave Technology Co's Payments of Debt can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Great Microwave Technology Co Payments of Debt Chart

Great Microwave Technology Co Annual Data
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Great Microwave Technology Co Quarterly Data
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Great Microwave Technology Co Payments of Debt Calculation

Payments of Debt represents all the cash outflow from debt, including both long-term debt and short-term debt.

Payments of Debt for the trailing twelve months (TTM) ended in Mar. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was ¥0.0 Mil.

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Great Microwave Technology Co Payments of Debt Related Terms

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Great Microwave Technology Co (SHSE:688270) Business Description

Traded in Other Exchanges
N/A
Address
No. 3, Xiyuan 3rd Road, Room 502, Building 5, Sandun Town, Xihu District, Zhejiang Province, Hangzhou, CHN, 310012
Great Microwave Technology Co Ltd is engaged in the research and development, production and sales of integrated circuit chips and microsystems.
Executives
Li Guo Ru Core technical personnel
Yu Fa Xin Director, core technical staff

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