Amkor Technology (STU:AMK) Issuance of Debt : €168 Mil (TTM As of Mar. 2024)

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What is Amkor Technology Issuance of Debt?

Amkor Technology's Issuance of Debt for the three months ended in Mar. 2024 was €5 Mil.

Amkor Technology's Issuance of Debt for the trailing twelve months (TTM) ended in Mar. 2024 was €168 Mil.

Amkor Technology Issuance of Debt Historical Data

The historical data trend for Amkor Technology's Issuance of Debt can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Amkor Technology Issuance of Debt Chart

Amkor Technology Annual Data

Trend

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Issuance of Debt

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1,169.74

599.90

326.65

449.44

512.65

Amkor Technology Quarterly Data
	Jun19	Sep19	Dec19	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24
Issuance of Debt	Get a 7-Day Free Trial															355.89	-	9.06	154.36	4.61

Amkor Technology Issuance of Debt Calculation

Issuance of Debt represents all the cash inflow from debt, including both long-term debt and short-term debt.

Issuance of Debt for the trailing twelve months (TTM) ended in Mar. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was €168 Mil.

Amkor Technology Issuance of Debt Related Terms

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Amkor Technology (STU:AMK) Business Description

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GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Amkor Technology Inc (STU:AMK) » Definitions » Issuance of Debt

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AMKR:USA AMK:Germany

Address

2045 East Innovation Circle, Tempe, AZ, USA, 85284

Website

https://www.amkor.com

Amkor Technology Inc is a provider of outsourced semiconductor packaging and test services to integrated device manufacturers, fabless semiconductor companies, and contract foundries. The firm's products are organized into two streams: advanced products, including flip chip, wafer-level processing and testing services; and mainstream products, including wirebond packaging and testing. Roughly a third of the firm's revenue is generated in the United States, with the rest coming from China, Ireland, Japan, Malaysia, Taiwan, Singapore, and countries across the world.