Tokyo Seimitsu Co (TSE:7729) Construction In Progress : 円0 Mil (As of Dec. 2023)

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What is Tokyo Seimitsu Co Construction In Progress?

Tokyo Seimitsu Co's annual construction in progress increased from Mar. 2021 (円407 Mil) to Mar. 2022 (円5,247 Mil) and increased from Mar. 2022 (円5,247 Mil) to Mar. 2023 (円9,221 Mil).

Tokyo Seimitsu Co Construction In Progress Historical Data

The historical data trend for Tokyo Seimitsu Co's Construction In Progress can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Tokyo Seimitsu Co Construction In Progress Chart

Tokyo Seimitsu Co Annual Data

Trend

Mar14

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Mar16

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Mar19

Mar20

Mar21

Mar22

Mar23

Construction In Progress

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222.00

2,246.00

407.00

5,247.00

9,221.00

Tokyo Seimitsu Co Quarterly Data
	Mar19	Jun19	Sep19	Dec19	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23
Construction In Progress	Get a 7-Day Free Trial															-	9,221.00	-	-	-

Tokyo Seimitsu Co Construction In Progress Calculation

It records the cost of construction work, which is not yet completed (typically, applied to capital budget items). A construction in progress item is not depreciated until the asset is placed in service. Normally, upon completion, a construction in progress item is reclassified, and the reclassified asset is capitalized and depreciated.

Tokyo Seimitsu Co (TSE:7729) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Tokyo Seimitsu Co Ltd (TSE:7729) » Definitions » Construction In Progress

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Traded in Other Exchanges

N/A

Address

2968-2, Ishikawa-machi, Hachioji-shi, Tokyo, JPN, 192-8515

Website

http://www.accretech.jp

Tokyo Seimitsu Co Ltd manufactures semiconductor production equipment and measuring instruments. The company through its subsidiaries manufactures probing machines, dicing machines, precision blade, polish grinders, chemical mechanical planarizers (CMPs), wafer slicing machines, wafer edge grinding machines, coordinate measuring machines, surface texture and contour measuring instruments, roundness and cylindrical profile measuring instruments, optical measuring instrument, machine control gauges, and various types of sensors. It also provides support services for its products.

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