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Mitsui High-tec (TSE:6966) EBITDA Margin % : 9.71% (As of Jan. 2024)


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What is Mitsui High-tec EBITDA Margin %?

EBITDA Margin % is calculated as EBITDA divided by its Revenue. Mitsui High-tec's EBITDA for the three months ended in Jan. 2024 was 円5,030 Mil. Mitsui High-tec's Revenue for the three months ended in Jan. 2024 was 円51,803 Mil. Therefore, Mitsui High-tec's EBITDA margin for the quarter that ended in Jan. 2024 was 9.71%.


Mitsui High-tec EBITDA Margin % Historical Data

The historical data trend for Mitsui High-tec's EBITDA Margin % can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Mitsui High-tec EBITDA Margin % Chart

Mitsui High-tec Annual Data
Trend Jan15 Jan16 Jan17 Jan18 Jan19 Jan20 Jan21 Jan22 Jan23 Jan24
EBITDA Margin %
Get a 7-Day Free Trial Premium Member Only Premium Member Only 8.32 11.48 17.32 18.28 17.12

Mitsui High-tec Quarterly Data
Apr19 Jul19 Oct19 Jan20 Apr20 Jul20 Oct20 Jan21 Apr21 Jul21 Oct21 Jan22 Apr22 Jul22 Oct22 Jan23 Apr23 Jul23 Oct23 Jan24
EBITDA Margin % Get a 7-Day Free Trial Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only Premium Member Only 0.06 10.23 12.91 12.01 9.71

Competitive Comparison of Mitsui High-tec's EBITDA Margin %

For the Semiconductors subindustry, Mitsui High-tec's EBITDA Margin %, along with its competitors' market caps and EBITDA Margin % data, can be viewed below:

* Competitive companies are chosen from companies within the same industry, with headquarter located in same country, with closest market capitalization; x-axis shows the market cap, and y-axis shows the term value; the bigger the dot, the larger the market cap. Note that "N/A" values will not show up in the chart.


Mitsui High-tec's EBITDA Margin % Distribution in the Semiconductors Industry

For the Semiconductors industry and Technology sector, Mitsui High-tec's EBITDA Margin % distribution charts can be found below:

* The bar in red indicates where Mitsui High-tec's EBITDA Margin % falls into.



Mitsui High-tec EBITDA Margin % Calculation

EBITDA margin is the ratio of EBITDA divided by net sales or Revenue, usually presented in percent.

Mitsui High-tec's EBITDA Margin % for the fiscal year that ended in Jan. 2024 is calculated as

EBITDA Margin %=EBITDA (A: Jan. 2024 )/Revenue (A: Jan. 2024 )
=33536/195881
=17.12 %

Mitsui High-tec's EBITDA Margin % for the quarter that ended in Jan. 2024 is calculated as

EBITDA Margin %=EBITDA (Q: Jan. 2024 )/Revenue (Q: Jan. 2024 )
=5030/51803
=9.71 %

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.


Mitsui High-tec  (TSE:6966) EBITDA Margin % Explanation

EBITDA Margin % is the ratio of EBITDA divided by net sales or Revenue. It is an performance metric measuring company's operating profitability. EBITDA Margin takes depreciation and amortization, interest expense and tax into account, which makes it easy to compare the relative profitability of companies of different sizes in the same industry.


Mitsui High-tec EBITDA Margin % Related Terms

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Mitsui High-tec (TSE:6966) Business Description

Traded in Other Exchanges
Address
2-10-1,Komine, Yahatanishi-ku, Kitakyushu, JPN, 807-8588
Mitsui High-tec Inc manufactures and sells lead frame, motor core, precision tooling and machine tools in Japan. Its precision tooling/precision parts products include motor core dies, lead frame dies, mold dies, trim and form dies, and other type of stamping tools used in motor cores and IC lead frames, electric motor cores, automobile components, coins, and resin injection molding. It also provides open lead frames for semiconductor packages; and motor parts.

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