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Mitsui High-tec (TSE:6966) Institutional Ownership : 16.33% (As of Apr. 27, 2024)


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What is Mitsui High-tec Institutional Ownership?

Institutional ownership is the percentage of shares that are owned by institutions out of the total shares outstanding. As of today, Mitsui High-tec's institutional ownership is 16.33%.

Insider Ownership is the percentage of shares that are owned by company insiders relative to the total shares outstanding. As of today, Mitsui High-tec's Insider Ownership is 0.00%.

Float Percentage Of Total Shares Outstanding is the percentage of float shares relative to the total shares outstanding. As of today, Mitsui High-tec's Float Percentage Of Total Shares Outstanding is 0.00%.


Mitsui High-tec Institutional Ownership Historical Data

The historical data trend for Mitsui High-tec's Institutional Ownership can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Mitsui High-tec Institutional Ownership Chart

Mitsui High-tec Historical Data

The historical data trend for Mitsui High-tec can be seen below:

2023-06-30 2023-07-31 2023-08-31 2023-09-30 2023-10-31 2023-11-30 2023-12-31 2024-01-31 2024-02-29 2024-03-31
Institutional Ownership 16.23 16.39 17.01 17.26 16.67 16.02 15.99 16.39 16.35 16.33

Mitsui High-tec Institutional Ownership Calculation

The percentage of shares that are owned by institutions out of the total shares outstanding.


Mitsui High-tec (TSE:6966) Business Description

Traded in Other Exchanges
Address
2-10-1,Komine, Yahatanishi-ku, Kitakyushu, JPN, 807-8588
Mitsui High-tec Inc manufactures and sells lead frame, motor core, precision tooling and machine tools in Japan. Its precision tooling/precision parts products include motor core dies, lead frame dies, mold dies, trim and form dies, and other type of stamping tools used in motor cores and IC lead frames, electric motor cores, automobile components, coins, and resin injection molding. It also provides open lead frames for semiconductor packages; and motor parts.

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