Mitsui High-tec (TSE:6966) Asset Impairment Charge : 円0 Mil (TTM As of Jan. 2024)

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What is Mitsui High-tec Asset Impairment Charge?

Mitsui High-tec's Asset Impairment Charge for the three months ended in Jan. 2024 was 円0 Mil. Its Asset Impairment Charge for the trailing twelve months (TTM) ended in Jan. 2024 was 円0 Mil.

Mitsui High-tec Asset Impairment Charge Historical Data

The historical data trend for Mitsui High-tec's Asset Impairment Charge can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Mitsui High-tec Asset Impairment Charge Chart

Mitsui High-tec Annual Data

Trend

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Asset Impairment Charge

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Mitsui High-tec Quarterly Data
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Mitsui High-tec Asset Impairment Charge Calculation

Asset Impairment Charge is the charge against earnings resulting from the aggregate write down of all assets from their carrying value to their fair value.

Asset Impairment Charge for the trailing twelve months (TTM) ended in Jan. 2024 adds up the quarterly data reported by the company within the most recent 12 months, which was 円0 Mil.

Mitsui High-tec Asset Impairment Charge Related Terms

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Mitsui High-tec (TSE:6966) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Mitsui High-tec Inc (TSE:6966) » Definitions » Asset Impairment Charge

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Traded in Other Exchanges

6966:Japan

Address

2-10-1,Komine, Yahatanishi-ku, Kitakyushu, JPN, 807-8588

Website

http://www.mitsui-high-tec.com

Mitsui High-tec Inc manufactures and sells lead frame, motor core, precision tooling and machine tools in Japan. Its precision tooling/precision parts products include motor core dies, lead frame dies, mold dies, trim and form dies, and other type of stamping tools used in motor cores and IC lead frames, electric motor cores, automobile components, coins, and resin injection molding. It also provides open lead frames for semiconductor packages; and motor parts.

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