Feb 28, 2023 / 05:00PM GMT
Michael Sullivan - Applied Materials, Inc. - VP of IR
Hello, and welcome to today's event. I'm Mike Sullivan, Head of Investor Relations at Applied Materials. We are launching 2 new products today during the SPIE lithography and patterning conference. Before we begin, I'd like to give you some context on how today's product introductions fit within the industry. What I'm showing you here are 3 ways to segment the wafer fab equipment market. You're probably familiar with the segmentation on the left, which is by equipment type.
You can see the Applied Materials' segments and share in blue. In the middle, you can see the equipment markets by device type, DRAM and NAND, along with foundry logic, both leading edge and ICAPS. On the right is the way engineers often segment the market, which is by application. The 4 major applications are patterning, which is used to define the features on each layer of the chip, along with transistor formation, interconnect formation and advanced packaging.
Patterning includes lithography and track tools, but these tools primarily transfer patterns from masks
Applied Materials Inc to Discuss Advanced Patterning Products Launch Call Transcript
Jan 22, 2024
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