ASE wins Device Technology of the Year award for VIPack™

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May 02, 2023

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced that its VIPack™ has received the ‘Device Technology of the Year Award’ in the 2023 3D InCites Awards program. This accolade recognizes industry-wide contributions in the development of heterogeneous integration technologies including 3D packaging, interposer integration, advanced fan-out wafer-level packaging, MEMS and sensors, and full system integration.