Formosa Advanced Technologies Co (TPE:8131) ROCE % : 14.27% (As of Mar. 2024)

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What is Formosa Advanced Technologies Co ROCE %?

ROCE % measures how well a company generates profits from its capital. It is calculated as EBIT divided by Capital Employed, where Capital Employed is calculated as Total Assets minus Total Current Liabilities. Formosa Advanced Technologies Co's annualized ROCE % for the quarter that ended in Mar. 2024 was 14.27%.

Formosa Advanced Technologies Co ROCE % Historical Data

The historical data trend for Formosa Advanced Technologies Co's ROCE % can be seen below:

* For Operating Data section: All numbers are indicated by the unit behind each term and all currency related amount are in USD.
* For other sections: All numbers are in millions except for per share data, ratio, and percentage. All currency related amount are indicated in the company's associated stock exchange currency.

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Formosa Advanced Technologies Co ROCE % Chart

Formosa Advanced Technologies Co Annual Data

Trend

Dec14

Dec15

Dec16

Dec17

Dec18

Dec19

Dec20

Dec21

Dec22

Dec23

ROCE %

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13.70

14.00

15.31

19.33

4.88

Formosa Advanced Technologies Co Quarterly Data
	Jun19	Sep19	Dec19	Mar20	Jun20	Sep20	Dec20	Mar21	Jun21	Sep21	Dec21	Mar22	Jun22	Sep22	Dec22	Mar23	Jun23	Sep23	Dec23	Mar24
ROCE %	Get a 7-Day Free Trial															9.08	8.11	1.82	1.02	14.27

Formosa Advanced Technologies Co ROCE % Calculation

Formosa Advanced Technologies Co's annualized ROCE % for the fiscal year that ended in Dec. 2023 is calculated as:

ROCE %	=	EBIT	/	( (Capital Employed	+	Capital Employed)	/ count )
		(A: Dec. 2023 )		(A: Dec. 2022 )		(A: Dec. 2023 )
	=	EBIT	/	( ( (Total Assets - Total Current Liabilities)	+	(Total Assets - Total Current Liabilities) )	/ count )
		(A: Dec. 2023 )		(A: Dec. 2022 )		(A: Dec. 2023 )
	=	629.175	/	( ( (14769.584 - 1403.5)	+	(13263.438 - 868.488) )	/ 2 )
	=	629.175	/	( (13366.084	+	12394.95)	/ 2 )
	=	629.175	/	12880.517
	=	4.88 %

Formosa Advanced Technologies Co's ROCE % of for the quarter that ended in Mar. 2024 is calculated as:

ROCE %	=	EBIT ⁽¹⁾	/	( (Capital Employed	+	Capital Employed)	/ count )
		(Q: Mar. 2024 )		(Q: Dec. 2023 )		(Q: Mar. 2024 )
	=	EBIT	/	( ( (Total Assets - Total Current Liabilities)	+	(Total Assets - Total Current Liabilities) )	/ count )
		(Q: Mar. 2024 )		(Q: Dec. 2023 )		(Q: Mar. 2024 )
	=	1745.044	/	( ( (13263.438 - 868.488)	+	(13361.955 - 1297.549) )	/ 2 )
	=	1745.044	/	( ( 12394.95	+	12064.406 )	/ 2 )
	=	1745.044	/	12229.678
	=	14.27 %

(1) Note: The EBIT data used here is four times the quarterly (Mar. 2024) EBIT data.

Formosa Advanced Technologies Co (TPE:8131) ROCE % Explanation

ROCE % can be especially useful when comparing the performance of capital-intensive companies. Unlike ROE %, which indicates the profitability of Shareholders Equity, ROCE % also considers long-term debt in Capital Employed. This can be helpful when analyzing companies with significant debt, as the result is neutralized by taking debt into consideration.

Generally speaking, a higher ROCE % indicates a stonger profitability for a company. Moreover, it is important to look at the ratio from a long term perspective. Investors tend to favor companies with stable and rising ROCE % trend over those with volatile ones.

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Formosa Advanced Technologies Co (TPE:8131) Business Description

Industry

GURUFOCUS.COM » STOCK LIST » Technology » Semiconductors » Formosa Advanced Technologies Co Ltd (TPE:8131) » Definitions » ROCE %

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N/A

Address

No.329, Ho-Nan Street, Touliu, TWN, 640

Website

https://www.fatc.com.tw

Formosa Advanced Technologies Co Ltd is a professional manufacturer of DRAM assembly, testing and module Turn-Key service in Taiwan. Its operations include the packaging, testing, processing, and research and development of integrated chips. The group's business activity is operated in Taiwan, Hong Kong, and South Korea. It provides services applied in thin small-outline packages (TSOPs), quad flat packages (QFPs), ball grid array (BGA) packages, chip probing (CP) testing, solid-state disk (SSD) testing, system-in-package (SIP) testing, embedded multimedia card (eMMC) testing, as well as cutting, grinding and testing of light-emitting diodes (LED) wafers, among others.

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